The 44th Annual IEEE Custom Integrated Circuits Conference (CICC 2023) [conference Reports]

Eric Soenen,Nan Sun,Arijit Raychowdhury,Samuel M. Palermo,Fa Foster Dai,Hua Wang,Christophe Antoine

DOI: https://doi.org/10.1109/mssc.2023.3285369

2023-01-01

IEEE Solid-State Circuits Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

What problem does this paper attempt to address?

Guest editorial: Selected papers from IEEE/CIC ICCC2014

Liu, Jing,Chen, Jiming,Yao, Mingwu

DOI: https://doi.org/10.1109/CC.2015.7084378

2015-01-01

Abstract:Since its successful inauguration in Beijing, August, 2012, the IEEE international Conference on Communications (ICCC) has been globally recognized as one of the important annual international conferences held by the IEEE Communication Society (ComSoc) and China Institute of Communications (CIC). IEEE/CIC ICCC'14, the third ICCC held in Shanghai, China, 13–15 October, 2014, continued to expand its influence and had attracted distinguished scholars, key researchers, young investigators and ambitious students from dozens of countries and regions. The technical program of ICCC 2014 features 4 world-class plenary keynote speeches, 8 technical symposia, 5 tutorials, 4 industrial and academic panels and 1 workshop, covering from decades-long hot topics such as MIMO, interference coordination, heterogeneous networks and etc., to recent eye-catchers such as big data and social networks. The conference not only provided a forum and seminar for active researchers from every directions of this academia, but also attracted delegates from the main players in the industry.
Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Samuel Palermo,Nan Sun

DOI: https://doi.org/10.1109/jssc.2019.2893079

IF: 5.4

2019-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits features expanded versions of key papers presented at the 2018 Custom Integrated Circuits Conference (CICC), held in the DoubleTree Mission Valley in San Diego, CA, USA, April 8–11.
Guest Editorial 2019 Custom Integrated Circuits Conference

Nan Sun,Jane Gu

DOI: https://doi.org/10.1109/jssc.2019.2961757

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of the IEEE Journal of Solid-State Circuits features expanded versions of key articles presented at the 2019 Custom Integrated Circuits Conference (CICC) held at Hilton, Austin, TX, USA, from April 14 to April 17.
Recap of the 42nd Edition of the International Conference on Computer- Aided Design (ICCAD 2023)

Evangeline Young

DOI: https://doi.org/10.1109/mdat.2024.3351568

2024-02-23

IEEE Design and Test

Abstract:This Year Marks our return to a fully in-person International Conference on Computer-Aided Design (ICCAD) after the COVID-19 pandemic. We are thrilled to resume an event with personal interactions and extensive networking while retaining some good practices adopted during the pandemic of having a virtual platform where participants and authors can connect remotely.

engineering, electrical & electronic,computer science, hardware & architecture
Selected papers from IEEE ICCT 2023

Feng Wei,Li Changle,Zhao Haitao,Jin Shi,Zhu Hongbo

DOI: https://doi.org/10.23919/jcc.2024.10771943

2024-12-04

China Communications

Abstract:IEEE International Conference on Communication Technology (ICCT) was jointly initiated and organized by IEEE Beijing Section and IEEE ComSoc in 1986. It is one of the highest-level academic events in the field of communication technology in China. It is also an international gathering for research for information and communication technology. IEEE ICCT 2023 was held in Wuxi, China on October 20–22, 2023. The key theme is "Advanced Communication and Internet of Things", which extensively covers the theoretical and practical innovations in the area of communications.

telecommunications
ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

Hussam Amrouch,Di Gao,Xiaobo Sharon Hu,Arman Kazemi,Ann Franchesca Laguna,Kai Ni,Michael T. Niemier,Mohammad Mehdi Sharifi,Simon Thomann,Xunzhao Yin,Cheng Zhuo

DOI: https://doi.org/10.1109/ICCAD51958.2021.9643578

2021-01-01

Abstract:The rapidly increasing volume and complexity of data is demanding the relentless scaling of computing power. With transistor feature size approaching physical limits, the benefits that CMOS technology can provide is diminishing. For future energy efficient computing systems, researchers aim to exploit various emerging nanotechnologies to replace conventional CMOS technology. In particular, ferroelectric FETs (FeFETs) appear to be a promising candidate to continue improving energy efficiency for data-intensive applications. Advances in FeFET scalability and FeFET compatibility with CMOS have sparked growing interest in device, circuit, and system communities. While FeFET is still evolving, many researchers and developers are already cautiously optimistic about its future. This paper provides a review on FeFET's recent technology advances, challenges, and opportunities, with a particular emphasis upon device modeling and circuit design of FeFET content addressable memory, as well as their applications in machine learning.
IEEE ICCI*CC Series in Year 20: Latest Advances in Cognitive Computing (plenary Panel Report-II).

Witold Kinsner,Haibin Zhu,George Baciu,Guiming Luo,Fernando Rubio,Jie Sui,Runhe Huang,Hironori Hiraishi,Jun Peng,Liang Chen

DOI: https://doi.org/10.1109/iccicc53683.2021.9811336

2021-01-01

Abstract:Cognitive Computing (CC) is a contemporary field of fundamental intelligence theories and general AI technologies triggered by the transdisciplinary development in intelligence, computer, brain, knowledge, cognitive, robotic, and cybernetic sciences for engineering implementations. This paper presents a summary of the plenary panel (Part II) on the theoretical foundations of CI/CC and recent breakthroughs in AI engineering reported in the 20th IEEE International ICCI*CC Conference (ICCI*CC'21). The latest advances in CI and CC towards general AI are presented by twenty-two distinguished panelists. Strategic AI engineering applications in CI, CC, and cognitive systems are elaborated for abstract intelligence, cognitive robots, autonomous systems, intelligent vehicles, and safety-and-mission-critical systems.
Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

Shahriar Mirabbasi,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2022.3222727

2023-01-01

IEEE Solid-State Circuits Magazine

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2023 is Building on 70 Years of Innovation in Solid-State Circuit Design. The IC design community has proved to be agile and resilient in a world scarred by the worldwide pandemic, and this years ISSCC commemorates the 70th anniversary of ISSCC with an edition that is more than ever focused on innovation. To enhance our lives and support increasingly more innovative developments, ISSCC promotes and shares new circuit ideas with potential to advance the state of the art for IC design and enable systems with ever-improving functionality and efficiency.

English Else
The Inaugural IEEE Microwave Theory and Technology Society Inter-Society Technology Panels at the 2023 Asia Pacific Microwave Conference

J.-C. Chiao,Chow-Yen Desmond Sim,Ke Wu

DOI: https://doi.org/10.1109/mmm.2024.3363974

IF: 3.0619

2024-04-24

IEEE Microwave Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

telecommunications,engineering, electrical & electronic
Through the Looking Glass-2020 Edition: Trends in Solid-State Circuits From ISSCC

Denis C. Daly,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2019.2952282

2020-01-01

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2020 is "Integrated Circuits Powering the Artificial Intelligence (AI) Era." Advances in solid-state circuits and systems have brought ever more powerful communication and computational capabilities into mobile form factors. Such ubiquitous smart devices lie at the heart of a revolution shaping how we connect, collaborate, build relationships, and share information. These social technologies enable people to maintain connections and support networks not otherwise possible; they provide the ability to access information instantaneously and from any location, thereby helping to shape world events and culture, empower citizens of all nations, and create social networks that help worldwide communities develop and form bonds based on common interests.

English Else
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems publication information

DOI: https://doi.org/10.1109/tcad.2019.2959957

2020-01-01

Abstract:Provides a listing of current staff, committee members and society officers.

engineering, electrical & electronic,computer science, interdisciplinary applications, hardware & architecture
International Solid-State Circuits Conference 2019 Aims at "envisioning the Future"

Haikun Jia,Baoyong Chi

DOI: https://doi.org/10.1007/s11432-019-9873-x

2019-01-01

Science China Information Sciences

Abstract:>The International Solid-State Circuits Conference(ISSCC) is well known as the best global forum with respect to solid-state circuits and systems-ona-chip. Held in San Francisco in January or February each year, the conference attracts more than
The Seventh IEEE Conference on Control Technology and Applications [Conference Reports]

Andrew Alleyne,Kira Barton

DOI: https://doi.org/10.1109/mcs.2023.3329968

2024-02-01

IEEE Control Systems

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

automation & control systems
Through the Looking Glass—The 2022 Edition: Trends in solid-state circuits from ISSCC

Shahriar Mirabbasi,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2021.3128243

2022-01-01

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2022 is Intelligent Silicon for a Sustainable World. This theme further highlights the fact that to cope with strong environmental changes, the circuit design community is evolving more than ever to support a more sustainable world. Given their widespread use in our everyday lives, without change, ICs will become the dominant energy consumer and source of carbon emissions in the (near) future. Despite phenomenal advances in solid-state circuits and systems, low-power circuit design is becoming increasingly more sophisticated in all application areas, from digital computation and machine learning to analog design. In the context of data communications, advances in wireless and wireline circuits will help optimize local and global communications energy. Various sensors can be deployed to measure environmental data and optimize energy consumption. Power management techniques continue to be an essential aspect of a majority of circuits and systems to extend their lifetime and battery longevity. Furthermore, new technologies are providing opportunities to develop innovative circuits, reduce fabrication impacts, and improve recyclability.

English Else
Cognitive Systems and Signal Processing

Fan Sun,Huaping Liu,Dewen Hu

DOI: https://doi.org/10.1007/978-981-13-7986-4

2019-01-01

Abstract:ICCSIP 2018 Proceedings on vision and image, algorithms, robotics, human-computer interaction, deep learning, information processing and automatic driving, machine learning, networks, Artificial Intelligence, cognitive systems, healthcare, environment.
A-SSCC 2021 Forward

Eun-Young Jung,Christopher J. Charles,Youngcheol Chae,Alioto Massimo,Changwoo Yoon,Woogeun Rhee

DOI: https://doi.org/10.1109/a-sscc53895.2021.9634178

2021-01-01

Abstract:Welcome to the IEEE Asian Solid-State Circuits Conference (A-SSCC) 2021.This year, the A-SSCC 2021 is held as a hybrid conference from Nov. 7th to Nov. 10th with attendees having the option to join the in-person meeting in Busan, Korea or participate virtually through on-line platform.Being one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, A-SSCC has grown to be a leading conference in the field of integrated circuits and systems design.The conference theme for this year is "Integrated Circuits and Systems for the Connection of Intelligent Things".The impact of COVID-19 has accelerated the trend of the mobile connectivity.Thereby, the role of integrated circuits has been more critical than ever to build an intelligent connection between human and human with high security and low power.The A-SSCC 2021 presents innovative silicon systems and circuit solutions to enrich our life with the Connection of Intelligent Things.This year, we received 249 submissions from 21 countries and regions around the world.Among all submissions, 94% of papers presented measurement results with silicon chips.After rigorous review process, the Technical Program Committee (TPC) selected 103 high quality papers with the acceptance rate of 41%.In addition, we invited 5 student papers from ESSCIRC 2021, having 108 technical paper presentations.From the A-SSCC 2021, the technical program is extended from a 3-day program to a 4-day program.Four plenary speeches are given by distinguished scholars and industry leaders.In the morning of Nov. 8,
IGIP/ICL2014 Conference

Call for Papers,Call For Papers

DOI: https://doi.org/10.3991/ijep.v4i1.3550

2014-02-08

International Journal of Engineering Pedagogy (iJEP)

Abstract:IGIP/ICL2014 Conference
Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Vadim Gutnik,Nikolaus Klemmer,Zhihua Wang,Michael Green,Roland Thewes

DOI: https://doi.org/10.1109/jssc.2009.2032593

IF: 5.4

2009-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 37 papers in this special issue were originally presented at the IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco, CA, in February 2009. They were take from the best of the Analog, Data Converters, RF, Wireless Communications, Wireline Communications, and MEMS, Imagers, and Display sessions.
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li,Xing-Chang Wei,Andreas C. Cangellaris,En-Xiao Liu,Yao-Jiang Zhang,Marcello D'Amore,Joungho Kim,Toshio Sudo

DOI: https://doi.org/10.1109/temc.2010.2048755

IF: 2.036

2010-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of effi...
Welcom to the 31st Annual Conference of the IEEE Industrial Electronics Society

Mo-Yuen Chow,Irwin, J.D.

DOI: https://doi.org/10.1109/IECON.2005.1568849

2005-01-01

Abstract:Presents the welcome message from the conference proceedings.

The 44th Annual IEEE Custom Integrated Circuits Conference (CICC 2023) [conference Reports]

Guest editorial: Selected papers from IEEE/CIC ICCC2014

Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Guest Editorial 2019 Custom Integrated Circuits Conference

Recap of the 42nd Edition of the International Conference on Computer- Aided Design (ICCAD 2023)

Selected papers from IEEE ICCT 2023

ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

IEEE ICCI*CC Series in Year 20: Latest Advances in Cognitive Computing (plenary Panel Report-II).

Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

The Inaugural IEEE Microwave Theory and Technology Society Inter-Society Technology Panels at the 2023 Asia Pacific Microwave Conference

Through the Looking Glass-2020 Edition: Trends in Solid-State Circuits From ISSCC

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems publication information

International Solid-State Circuits Conference 2019 Aims at "envisioning the Future"

The Seventh IEEE Conference on Control Technology and Applications [Conference Reports]

Through the Looking Glass—The 2022 Edition: Trends in solid-state circuits from ISSCC

Cognitive Systems and Signal Processing

A-SSCC 2021 Forward

IGIP/ICL2014 Conference

Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Welcom to the 31st Annual Conference of the IEEE Industrial Electronics Society