Guest Editorial 2019 Custom Integrated Circuits Conference

Nan Sun,Jane Gu

DOI: https://doi.org/10.1109/jssc.2019.2961757

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of the IEEE Journal of Solid-State Circuits features expanded versions of key articles presented at the 2019 Custom Integrated Circuits Conference (CICC) held at Hilton, Austin, TX, USA, from April 14 to April 17.

What problem does this paper attempt to address?

Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Samuel Palermo,Nan Sun

DOI: https://doi.org/10.1109/jssc.2019.2893079

IF: 5.4

2019-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits features expanded versions of key papers presented at the 2018 Custom Integrated Circuits Conference (CICC), held in the DoubleTree Mission Valley in San Diego, CA, USA, April 8–11.
Guest editorial: Selected papers from IEEE/CIC ICCC2014

Liu, Jing,Chen, Jiming,Yao, Mingwu

DOI: https://doi.org/10.1109/CC.2015.7084378

2015-01-01

Abstract:Since its successful inauguration in Beijing, August, 2012, the IEEE international Conference on Communications (ICCC) has been globally recognized as one of the important annual international conferences held by the IEEE Communication Society (ComSoc) and China Institute of Communications (CIC). IEEE/CIC ICCC'14, the third ICCC held in Shanghai, China, 13–15 October, 2014, continued to expand its influence and had attracted distinguished scholars, key researchers, young investigators and ambitious students from dozens of countries and regions. The technical program of ICCC 2014 features 4 world-class plenary keynote speeches, 8 technical symposia, 5 tutorials, 4 industrial and academic panels and 1 workshop, covering from decades-long hot topics such as MIMO, interference coordination, heterogeneous networks and etc., to recent eye-catchers such as big data and social networks. The conference not only provided a forum and seminar for active researchers from every directions of this academia, but also attracted delegates from the main players in the industry.
The 44th Annual IEEE Custom Integrated Circuits Conference (CICC 2023) [conference Reports]

Eric Soenen,Nan Sun,Arijit Raychowdhury,Samuel M. Palermo,Fa Foster Dai,Hua Wang,Christophe Antoine

DOI: https://doi.org/10.1109/mssc.2023.3285369

2023-01-01

IEEE Solid-State Circuits Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Vadim Gutnik,Nikolaus Klemmer,Zhihua Wang,Michael Green,Roland Thewes

DOI: https://doi.org/10.1109/jssc.2009.2032593

IF: 5.4

2009-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 37 papers in this special issue were originally presented at the IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco, CA, in February 2009. They were take from the best of the Analog, Data Converters, RF, Wireless Communications, Wireline Communications, and MEMS, Imagers, and Display sessions.
Integrated Circuits for Communications [series Editorial]

Charles Chien,Zhiwei Xu

DOI: https://doi.org/10.1109/mcom.2016.7588287

IF: 9.03

2016-01-01

IEEE Communications Magazine

Abstract:In this issue of Topics in Integrated Circuits for Communications, the first article continues the theme from our last issue in April on the role of analog-to-digital converters (ADCs) in the digitization of analog information for efficient high-speed data links. Then the second article highlights recent progress in the integrated circuits design of communication payloads in spacecraft aimed at future deep space exploration.
Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

Jung-Hwan Choi,Po-Chiun Huang,Woogeun Rhee,Shouyi Yin

DOI: https://doi.org/10.1109/jssc.2022.3196310

IF: 5.4

2022-01-01

IEEE Journal of Solid-State Circuits

Abstract:The Special Issue of the IEEE Journal of Solid- State Circuits (JSSC) includes some of the highlights of the best papers presented at the 2021 Asian Solid-State Circuits Conference (A-SSCC). This year, the A-SSCC 2021 is held as a hybrid conference on November 7-10, 2021 with attendees having the option to join the in-person meeting in Busan, Korea, or participate virtually through on-line platform. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 17th appearance in 2021 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SoC). From 2021, only two-page format articles are allowed for submission and publication.
Topics in integrated circuits for communications [Guest editorial]

Charles Chien,Zhiwei Xu,Stephen Molloy

DOI: https://doi.org/10.1109/mcom.2011.5741154

IF: 9.03

2011-01-01

IEEE Communications Magazine

Abstract:The dream of being able to stay connected anywhere and at any time has finally come true with the advent of smartphones in late 2006. Since then smartphones have proliferated rapidly. In 2010, 300 million smartphones were shipped worldwide, up nearly 75 percent from 2009. Soon more than half of the communication systems on chips (SoCs) in the cellular market will be geared for smartphones. Aside from delivering high throughputs enabled by 3G/4G communication processing, such SoCs offer integrated support for myriad peripheral functions including Wi-Fi, GPS, Bluetooth, and FM radio. Moreover, these highly sophisticated SoCs will have computation power upwards of a few GHz hosting powerful operating systems that enable innovations and customizations essential to create feature rich multimedia services in a portable handheld device.
Guest Editorial: Special Issue on Selected Articles From IEEE BioCAS 2023

Chung-Chih Hung,Mohamed Atef,Vanessa Chen

DOI: https://doi.org/10.1109/tbcas.2024.3434009

2024-08-24

IEEE Transactions on Biomedical Circuits and Systems

Abstract:The 12 articles in this special issue were presented at the 2023 IEEE Biomedical Circuits and Systems Conference (BioCAS) in Toronto, Canada, from October 19–21, 2023. BioCAS 2023 was jointly sponsored by the IEEE Circuits and Systems (CAS) Society, IEEE Solid-State Circuits (SSC) Society, and the IEEE Engineering in Medicine and Biology (EMB) Society.

engineering, biomedical, electrical & electronic
Guest editorial: Selected papers from IEEE ICCC'12

Zhisheng, N.,Molisch, A.F.,Junshan, Z.

DOI: https://doi.org/10.1109/CC.2013.6457525

2013-01-01

Abstract:The papers in this special issue were presetned at the First IEEE International Conference on Communications in China (ICCC'12) that was held in Beijing, China, 15-17 August, 2012.
Integrated Circuits for Communications

Charles Chien,Zhiwei Xu

DOI: https://doi.org/10.1109/mcom.2017.8067700

IF: 9.03

2017-01-01

IEEE Communications Magazine

Abstract:The articles in this special section highlight the recent progress in the integrated circuits design of 3D imagers based on optical and microwave circuits to support high resolution imaging for various applications such as in-home spectroscopy for personal health diagnostics to meet the needs of aging populations.
ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

Hussam Amrouch,Di Gao,Xiaobo Sharon Hu,Arman Kazemi,Ann Franchesca Laguna,Kai Ni,Michael T. Niemier,Mohammad Mehdi Sharifi,Simon Thomann,Xunzhao Yin,Cheng Zhuo

DOI: https://doi.org/10.1109/ICCAD51958.2021.9643578

2021-01-01

Abstract:The rapidly increasing volume and complexity of data is demanding the relentless scaling of computing power. With transistor feature size approaching physical limits, the benefits that CMOS technology can provide is diminishing. For future energy efficient computing systems, researchers aim to exploit various emerging nanotechnologies to replace conventional CMOS technology. In particular, ferroelectric FETs (FeFETs) appear to be a promising candidate to continue improving energy efficiency for data-intensive applications. Advances in FeFET scalability and FeFET compatibility with CMOS have sparked growing interest in device, circuit, and system communities. While FeFET is still evolving, many researchers and developers are already cautiously optimistic about its future. This paper provides a review on FeFET's recent technology advances, challenges, and opportunities, with a particular emphasis upon device modeling and circuit design of FeFET content addressable memory, as well as their applications in machine learning.
Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Tahir Hussain,Dana C. Wheeler,Hasan Sharifi,Keisuke Shinohara,Zhiwei Xu,James C. Li,Pamela R. Patterson,Kenneth R. Elliott,Wonill Ha,Yakov Royter,Peter D. Brewer

DOI: https://doi.org/10.1109/sirf.2014.6828535

2014-01-01

Abstract:HRL Laboratories is part of an intense research and development effort to leverage the enormously advanced infrastructure of Si CMOS and the high performance of diverse electronic and photonic devices in an integrated technology. While System in a Package (SiP) and System on a Chip (SoC) approaches involve chips produced in their native foundries and subsequent integration using hybridization or multi-chip modules, HRL has pioneered approaches where partially completed wafers of diverse technologies are integrated using highly intimate placement and heterogeneous interconnects to enable transistor-level integration. Novel ICs have been produced in InP BiCMOS and CMOS memristor-integrated technologies. Unprecedented design flexibility is being enabled with intimate integration of GaN HEMTs together with InP and CMOS.
Introduction to the Special Section on the 2013 Ieee Asian Solid-State Circuits Conference (A-Sscc)

Zhihua Wang

DOI: https://doi.org/10.1109/jssc.2014.2362359

IF: 5.4

2014-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 14 papers in this special section were originally presented at the 2013 IEEE Asian Solid-State Circuits Circuit Conference (A-SSCC), held in Singapore on November 11-13, 2013.
Introduction to the Special Section on the 2019 RFIC Symposium

Hongtao Xu

DOI: https://doi.org/10.1109/jssc.2020.2982726

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits (JSSC) covers expanded articles from the 2019 Radio Frequency Integrated Circuits Symposium (RFIC Symposium), which was held on June 2–4, 2019, in Boston, MA, USA.
Through the Looking Glass-2020 Edition: Trends in Solid-State Circuits From ISSCC

Denis C. Daly,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2019.2952282

2020-01-01

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2020 is "Integrated Circuits Powering the Artificial Intelligence (AI) Era." Advances in solid-state circuits and systems have brought ever more powerful communication and computational capabilities into mobile form factors. Such ubiquitous smart devices lie at the heart of a revolution shaping how we connect, collaborate, build relationships, and share information. These social technologies enable people to maintain connections and support networks not otherwise possible; they provide the ability to access information instantaneously and from any location, thereby helping to shape world events and culture, empower citizens of all nations, and create social networks that help worldwide communities develop and form bonds based on common interests.

English Else
Introduction to the Special Issue on the 2023 Symposium on VLSI Circuits

Mototsugu Hamada,Ron Kapusta

DOI: https://doi.org/10.1109/jssc.2024.3357259

IF: 5.4

2024-03-29

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of IEEE Journal of Solid-State Circuits highlights some of the outstanding circuit papers presented at the Symposium on VLSI Technology and Circuits. The Symposium was held in person, June 11–16, 2023, in Kyoto, Japan.

engineering, electrical & electronic
Guest Editorial Introduction to the Special Section on the 2023 RFIC Symposium

Kenichi Okada

DOI: https://doi.org/10.1109/jssc.2024.3379608

IF: 5.4

2024-04-27

IEEE Journal of Solid-State Circuits

Abstract:This special section of the IEEE Journal of Solid-State Circuits presents the expanded versions of selected articles presented at the 2023 Radio Frequency Integrated Circuits Symposium (RFIC) held in San Diego, CA, USA, during June 11–13, 2023. The RFIC Symposium is the world's premier conference focused on RF and millimeter-wave (mmWave) integrated circuits and systems technology. In addition to showcasing state-of-the-art high-frequency IC design techniques, the conference has evolved to encompass a wide range of emerging technologies and applications, including wireless/wireline communication, cryogenic technology, and other innovations in RF, millimeter-wave, terahertz-wave, and analog/mixed-signal ICs. The collection of papers in this special Section reflects the diversity and multidisciplinary nature of the RFIC Symposium.

engineering, electrical & electronic
Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

Shahriar Mirabbasi,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2022.3222727

2023-01-01

IEEE Solid-State Circuits Magazine

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2023 is Building on 70 Years of Innovation in Solid-State Circuit Design. The IC design community has proved to be agile and resilient in a world scarred by the worldwide pandemic, and this years ISSCC commemorates the 70th anniversary of ISSCC with an edition that is more than ever focused on innovation. To enhance our lives and support increasingly more innovative developments, ISSCC promotes and shares new circuit ideas with potential to advance the state of the art for IC design and enable systems with ever-improving functionality and efficiency.

English Else
Guest Editorial: Integrated Devices, Circuits, and Systems for the 6G Era

Xi Zhu,Roberto Gómez-García,Chun-Hsing Li,Bryan Schwitter

DOI: https://doi.org/10.1109/jetcas.2024.3367094

IF: 5.877

2024-03-15

IEEE Journal on Emerging and Selected Topics in Circuits and Systems

Abstract:This Special Issue of the IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) is dedicated to demonstrating the latest research progress on integrated devices, circuits and systems for the 6G Era. As 5G rolls out worldwide, teams of visionary experts are developing roadmaps and revolutionary applications for the next-generation wireless network: 6G. Indeed, the 6G mobile networks will establish new standards to fulfill the unreachable performance required by the current 5G networks. It is anticipated that 6G technology will be capable of supporting extremely high-performance connectivity with massive numbers of connected devices.

engineering, electrical & electronic
Guest Editorial Special Issue on Semiconductor Device Modeling for Circuit and System Design

Yogesh Singh Chauhan

DOI: https://doi.org/10.1109/ted.2023.3340462

IF: 3.1

2024-01-01

IEEE Transactions on Electron Devices

Abstract:I am delighted and honored to open this IEEE Transactions on Electron Devices (TED) Special Issue on Semiconductor Device Modeling for Circuit and System Design for readers and researchers across the globe. The last IEEE TED Special Issue on Compact Modeling was published half a decade ago in 2018. A lot of new innovations have happened since then, and several emerging technologies have taken central space. This has encouraged us for a dedicated special issue to engage Electron Devices Community in a serious discussion with their scholarly contributions specifically focused on solving major challenges in the broad area of semiconductor device modeling for circuit and system design.

engineering, electrical & electronic,physics, applied

Guest Editorial 2019 Custom Integrated Circuits Conference

Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Guest editorial: Selected papers from IEEE/CIC ICCC2014

The 44th Annual IEEE Custom Integrated Circuits Conference (CICC 2023) [conference Reports]

Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Integrated Circuits for Communications [series Editorial]

Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

Topics in integrated circuits for communications [Guest editorial]

Guest Editorial: Special Issue on Selected Articles From IEEE BioCAS 2023

Guest editorial: Selected papers from IEEE ICCC'12

Integrated Circuits for Communications

ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Introduction to the Special Section on the 2013 Ieee Asian Solid-State Circuits Conference (A-Sscc)

Introduction to the Special Section on the 2019 RFIC Symposium

Through the Looking Glass-2020 Edition: Trends in Solid-State Circuits From ISSCC

Introduction to the Special Issue on the 2023 Symposium on VLSI Circuits

Guest Editorial Introduction to the Special Section on the 2023 RFIC Symposium

Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

Guest Editorial: Integrated Devices, Circuits, and Systems for the 6G Era

Guest Editorial Special Issue on Semiconductor Device Modeling for Circuit and System Design