Integrated Circuits for Communications

Charles Chien,Zhiwei Xu
DOI: https://doi.org/10.1109/mcom.2017.8067700
IF: 9.03
2017-01-01
IEEE Communications Magazine
Abstract:The articles in this special section highlight the recent progress in the integrated circuits design of 3D imagers based on optical and microwave circuits to support high resolution imaging for various applications such as in-home spectroscopy for personal health diagnostics to meet the needs of aging populations.
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