Highlight of ISSCC 2008 Papers in RF and Wireless Communication and the Progress of R&D on IC Design Community in Mainland China, Taiwan and Hong Kong

Zhihua Wang

DOI: https://doi.org/10.1109/rfit.2007.4443985

2007-01-01

Abstract:This article consists of a collection of slides from the author's conference presentation.

What problem does this paper attempt to address?

Guest editorial: Selected papers from IEEE/CIC ICCC2014

Liu, Jing,Chen, Jiming,Yao, Mingwu

DOI: https://doi.org/10.1109/CC.2015.7084378

2015-01-01

Abstract:Since its successful inauguration in Beijing, August, 2012, the IEEE international Conference on Communications (ICCC) has been globally recognized as one of the important annual international conferences held by the IEEE Communication Society (ComSoc) and China Institute of Communications (CIC). IEEE/CIC ICCC'14, the third ICCC held in Shanghai, China, 13–15 October, 2014, continued to expand its influence and had attracted distinguished scholars, key researchers, young investigators and ambitious students from dozens of countries and regions. The technical program of ICCC 2014 features 4 world-class plenary keynote speeches, 8 technical symposia, 5 tutorials, 4 industrial and academic panels and 1 workshop, covering from decades-long hot topics such as MIMO, interference coordination, heterogeneous networks and etc., to recent eye-catchers such as big data and social networks. The conference not only provided a forum and seminar for active researchers from every directions of this academia, but also attracted delegates from the main players in the industry.
Topics in integrated circuits for communications [Guest editorial]

Charles Chien,Zhiwei Xu,Stephen Molloy

DOI: https://doi.org/10.1109/mcom.2011.5741154

IF: 9.03

2011-01-01

IEEE Communications Magazine

Abstract:The dream of being able to stay connected anywhere and at any time has finally come true with the advent of smartphones in late 2006. Since then smartphones have proliferated rapidly. In 2010, 300 million smartphones were shipped worldwide, up nearly 75 percent from 2009. Soon more than half of the communication systems on chips (SoCs) in the cellular market will be geared for smartphones. Aside from delivering high throughputs enabled by 3G/4G communication processing, such SoCs offer integrated support for myriad peripheral functions including Wi-Fi, GPS, Bluetooth, and FM radio. Moreover, these highly sophisticated SoCs will have computation power upwards of a few GHz hosting powerful operating systems that enable innovations and customizations essential to create feature rich multimedia services in a portable handheld device.
Integrated Circuits for Communications [series Editorial]

Charles Chien,Zhiwei Xu

DOI: https://doi.org/10.1109/mcom.2016.7588287

IF: 9.03

2016-01-01

IEEE Communications Magazine

Abstract:In this issue of Topics in Integrated Circuits for Communications, the first article continues the theme from our last issue in April on the role of analog-to-digital converters (ADCs) in the digitization of analog information for efficient high-speed data links. Then the second article highlights recent progress in the integrated circuits design of communication payloads in spacecraft aimed at future deep space exploration.
THz Interconnect for Inter-/Intra-chip Communication

Qun Jane Gu,Bo Yu,Xuan Ding,Yu Ye,Xiaoguang Liu,Zhiwei Xu

DOI: https://doi.org/10.1117/12.2518567

2019-01-01

Abstract:“Interconnect Gap”, caused by the gap between the ever-increasing data rate demand of inter-/intra- chip communications and the insufficient capabilities, has intrigued active research over a decade from both electronics and optics domains, so called electrical interconnect (EI) and optical interconnect (OI). However, it is challenging for both EI and OI to completely address the interconnect issues individually due to their inherent challenges. THz Interconnect (TI), utilizing the frequency spectrum sandwiched between microwave and optical frequencies, holds the high potentials to complement EI and OI by leveraging the advantages of both electronics and optics. Continuous scaling of mainstream silicon technologies enables THz electronics in silicon. On the other hand, THz dielectric waveguides, similar to their optical counterpart fiber, have small dimensions and present low loss at THz frequencies. This paper will present the research activities in the high potential TI field, including high efficiency THz signal generation and modulation circuits, low loss and wide bandwidth THz silicon waveguide channels together with ortho-mode support, and system demonstration of the THz Interconnect for chip to chip communications.
Terahertz Photonics in Radar and ISAC Applications

Xianbin Yu,Zhidong Lyu,Zuomin Yang,Hongqi Zhang,Hang Yang,Nan Li,Changming Zhang,Xiaodan Pang,Oskars Ozolins,Lu Zhang,Xianmin Zhang

DOI: https://doi.org/10.1109/ACP/POEM59049.2023.10368967

2023-01-01

Abstract:This paper reviews our recent progress on photonic terahertz radar and integrated sensing and communication (ISAC) systems in the 300GHz band with distinguished sensing performance.
Digital-intensive RFIC Design Techniques for Transmitters in ISSCC 2023

Yun Yin,Hongtao Xu

DOI: https://doi.org/10.1088/1674-4926/44/4/040203

2023-01-01

Journal of Semiconductors

Abstract:Sub-6 GHz multi-standard wireless communication and millimeter-wave(mm-wave)wireless transmission provide users with multi-functionality and unprecedented wireless con-nectivity.With CMOS process scaling down,system-on-chip(SoC)implementation of wireless systems along with RFIC func-tionality is highly desirable for low cost and small form-factor.The digital transceiver architecture aligns with Moore's law to provide compact die area,better interface to digital backend and higher efficiency due to the faster switching nature of core devices[1-28].
Introduction to the Special Issue on the 2010 IEEE RFIC Symposium

Yuhua Cheng

DOI: https://doi.org/10.1109/jssc.2011.2116330

IF: 5.4

2011-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 19 papers in this special issue were originally presented at 2010 IEEE RFIC Symposium, held May 23-25, 2010, in Anaheim, CA, USA. The first group of papers presents designs on components such as filters, phase-locked loops, attenuators, and power amplifiers. The second group of papers reports achievements on the design of transmitters, receivers, and transceivers. The third group of papers dis...
Antenna Research and Development in Singapore

Zhi Ning Chen,Xianming Qing,Yue Ping Zhang,Zhongxiang Shen,Eng Leong Tan,Er Ping Li

2013-01-01

Abstract:This paper briefly overviews the research and development (R&D) of antennas and computational electromagnetics in public research institutions in Singapore. The R&D activities of local universities and research institutes in particular, from Agency of Science, Technology and Research (A*STAR) in these areas are briefed with the selected projects from 10 MHz to 10 THz.
Design of Wireless Communication System Based on nRF905

Zhou Chao,Wang Chen

2009-01-01

Abstract:This paper introduces a wireless communication module based on Atmega128L of Atmel and single-chip RF transceiver chip nRF905 of Nordic,and introduces the system working principle,hardware design and software design,and gives out the main procedures. This system has Advantages of low cost,easy expansion,easy operation,etc.,can be widely used in remote control,wireless data collection and other fields.
Integrated Photonics Research in China

Andrew W. Poon,Linjie Zhou,Jianping Chen,Yong-Zhen Huang,Jinzhong Yu,Jian-Jun He,Hon K. Tsang

DOI: https://doi.org/10.1364/opn.22.9.000022

2011-01-01

Abstract:Chinese researchers already have a decades-long history of making key contributions to integrated photonics research. Now, with a growing number of research groups and unprecedented government backing, the country is poised to take a leading role in this exciting area, which is a critical driver of global communications technology.
The Progress of Research on Signals and Systems in China of Year 1998~2001

Lu LIU,Zhihua WANG

2001-01-01

Abstract:Signals and systems is an important aspect of radio science. The recent progress of the research activities of signals and systems in China is reviewed in this paper. It covers the most advanced and important developments during years of 1998~2001. The review is based on the following categories: wideband CDMA, software radio, digital audio broadcasting technologies, information processing, radar target recognition, electronics design automation, integrated circuit design.
Broadband Nanophotonic Wireless Links and Networks Using On-Chip Integrated Plasmonic Antennas.

Yuanqing Yang,Qiang Li,Min Qiu

DOI: https://doi.org/10.1038/srep19490

IF: 4.6

2016-01-01

Scientific Reports

Abstract:Owing to their high capacity and flexibility, broadband wireless communications have been widely employed in radio and microwave regimes, playing indispensable roles in our daily life. Their optical analogs, however, have not been demonstrated at the nanoscale. In this paper, by exploiting plasmonic nanoantennas, we demonstrate the complete design of broadband wireless links and networks in the realm of nanophotonics. With a 100-fold enhancement in power transfer superior to previous designs as well as an ultrawide bandwidth that covers the entire telecommunication wavelength range, such broadband nanolinks and networks are expected to pave the way for future optical integrated nanocircuits.
Advancement in the Research of CMOS RF IC's

张国艳,黄如,张兴,王阳元

DOI: https://doi.org/10.3969/j.issn.1004-3365.2004.04.006

2004-01-01

Abstract:In recent years, great progress has been made in the application and development of radio frequency integrated circuits (RF IC), while the research of CMOS RF IC's is becoming a hot topic in this field. The application of CMOS technology to RF and microwave domain is discussed, and the commonly used transceiver architectures are elaborated, together with their problems and solutions. Moreover, the key front-end blocks in the transceiver, including low noise amplifier (LNA), mixer, voltage controlled oscillator (VCO), power amplifier (PA) and passive elements, have been summarized. Finally, the future research direction of CMOS technology in RF IC domain is examined.
Integrated Circuits for Communications

Charles Chien,Zhiwei Xu

DOI: https://doi.org/10.1109/mcom.2017.8067700

IF: 9.03

2017-01-01

IEEE Communications Magazine

Abstract:The articles in this special section highlight the recent progress in the integrated circuits design of 3D imagers based on optical and microwave circuits to support high resolution imaging for various applications such as in-home spectroscopy for personal health diagnostics to meet the needs of aging populations.
Introduction to the Special Section on the 2019 RFIC Symposium

Hongtao Xu

DOI: https://doi.org/10.1109/jssc.2020.2982726

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits (JSSC) covers expanded articles from the 2019 Radio Frequency Integrated Circuits Symposium (RFIC Symposium), which was held on June 2–4, 2019, in Boston, MA, USA.
Guest editorial: Selected papers from IEEE ICCC'12

Zhisheng, N.,Molisch, A.F.,Junshan, Z.

DOI: https://doi.org/10.1109/CC.2013.6457525

2013-01-01

Abstract:The papers in this special issue were presetned at the First IEEE International Conference on Communications in China (ICCC'12) that was held in Beijing, China, 15-17 August, 2012.
Introduction to the Special Section on the 2013 Ieee Asian Solid-State Circuits Conference (A-Sscc)

Zhihua Wang

DOI: https://doi.org/10.1109/jssc.2014.2362359

IF: 5.4

2014-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 14 papers in this special section were originally presented at the 2013 IEEE Asian Solid-State Circuits Circuit Conference (A-SSCC), held in Singapore on November 11-13, 2013.
Design of Reconfigurable Intelligent Surfaces for Wireless Communication: A Review

Rujing Xiong,Jianan Zhang,Fuhai Wang,Zhengyu Wang,Xiang Ren,Junshuo Liu,Jialong Lu,Kai Wan,Tiebin Mi,Robert Caiming Qiu

2023-10-25

Abstract:This paper addresses the hardware structure of Reconfigurable Intelligent Surfaces (RIS) and presents a comprehensive overview of RIS design, considering both unit design and prototype systems. It commences by tracing the evolutionary trajectory of RIS, originating from static cell-structured hypersurfaces. The article conducts a meticulous examination from the standpoint of adaptability, elucidating the diverse array of unit structures and design philosophies that underlie existing RIS frameworks. Following this, the study systematically categorizes and synthesizes channel modeling research for RIS-facilitated wireless communication, leveraging both physical insights and statistical data. Additionally, the article provides a detailed exposition of current RIS experimental setups and their corresponding empirical findings, delving into the attributes of prototype design and system functionalities. Moreover, this work introduces an in-house developed RIS prototype. The prototype undergoes rigorous empirical evaluation, encompassing multi-hop RIS signal amplification, image reconstruction, and real-world indoor signal coverage experiments. The empirical results robustly affirm the efficacy of RIS in effectively mitigating signal coverage blind spots and enabling radio wave imaging. With RIS-enhanced augmentation, the average indoor signal gain surpasses 8 dB.

Systems and Control
Design architecture and algorithm of wireless network integrated circuit based on 5G+AI

Pengjun Wang,Jiahao Qin,Jiucheng Li,Meng Wu,Shan Zhou,Le Feng

DOI: https://doi.org/10.1016/j.phycom.2022.101981

IF: 2.379

2023-01-01

Physical Communication

Abstract:In the current integrated circuit (IC) design process, research on its design process is relatively backward. This paper mainly adopts 5G + artificial intelligence technology, and conducts an in-depth discussion on the structure and algorithm of wireless network integrated circuits. The article analyzes the development of IC industry and the application of EDA software, and puts forward some problems that China’s IC industry is currently facing. The article discusses the realization of IC design flow, which is realized from five aspects: design input, function simulation, layout realization, physical verification, and post-parasitic simulation. Then, in view of the problems existing in the current IC design process, specific solutions for improvement and strengthening are given. Four parts are designed in detail, namely multi-mode simulation, realization of fully automated layout, feature extraction and modeling, IR Drop and EM analysis. Combined with the widely used characteristics of IP design reuse technology, this paper conducts a targeted research on the process of IP design reuse. From the IP circuit transplantation and IP layout transplantation, the specific discussion is carried out. From the perspective of IP design reuse, the design process of the wireless network integrated circuit is further improved. This paper turns to the design of RF IC from the perspective of IC design process, giving the flow chart of RF chip. The test results showed that over the full temperature range, the total current was about 2.45 mA, which met the design requirements. When the load resistance is 4KΩ, the ascending propagation delay is 92tns and the descending propagation delay is 65tns, both of which increase significantly. The article can provide further reference for the design of wireless network integrated circuits.
Reconfigurable Reflectarrays and Transmitarrays: from Antenna Designs to System Applications

Fan Yang,Shenheng Xu,Xiaotian Pan,Xue Yang,Jun Luo,Min Wang,Yu Wang,Maokun Li

DOI: https://doi.org/10.1049/cp.2018.0885

2018-01-01

Abstract:This paper reviews the recent research progress on reconfigurable reflectarrays (RRA) and reconfigurable transmitarrays (RTA) at Tsinghua University. Numerous antenna designs are presented, including W-band RRA, 2-bit RRA, 10240-element RRA, 2-layer RTA, and current-reversal RTA. Furthermore, the RRA and RTA demonstrate a promising potential in advanced wireless systems. As an example, a RRA-based security imaging system is illustrated in details.

Highlight of ISSCC 2008 Papers in RF and Wireless Communication and the Progress of R&#x00026;D on IC Design Community in Mainland China, Taiwan and Hong Kong

Guest editorial: Selected papers from IEEE/CIC ICCC2014

Topics in integrated circuits for communications [Guest editorial]

Integrated Circuits for Communications [series Editorial]

THz Interconnect for Inter-/Intra-chip Communication

Terahertz Photonics in Radar and ISAC Applications

Digital-intensive RFIC Design Techniques for Transmitters in ISSCC 2023

Introduction to the Special Issue on the 2010 IEEE RFIC Symposium

Antenna Research and Development in Singapore

Design of Wireless Communication System Based on nRF905

Integrated Photonics Research in China

The Progress of Research on Signals and Systems in China of Year 1998~2001

Broadband Nanophotonic Wireless Links and Networks Using On-Chip Integrated Plasmonic Antennas.

Advancement in the Research of CMOS RF IC's

Integrated Circuits for Communications

Introduction to the Special Section on the 2019 RFIC Symposium

Guest editorial: Selected papers from IEEE ICCC'12

Introduction to the Special Section on the 2013 Ieee Asian Solid-State Circuits Conference (A-Sscc)

Design of Reconfigurable Intelligent Surfaces for Wireless Communication: A Review

Design architecture and algorithm of wireless network integrated circuit based on 5G+AI

Reconfigurable Reflectarrays and Transmitarrays: from Antenna Designs to System Applications

Highlight of ISSCC 2008 Papers in RF and Wireless Communication and the Progress of R&D on IC Design Community in Mainland China, Taiwan and Hong Kong