Abstract:Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to uniform film stress and system curvature states over the entire system of a single thin film on a substrate. By considering a circular multilayer thin film/substrate system subjected to nonuniform temperature distributions, we derive relations between the stresses in each film and temperature, and between the system curvatures and temperature. These relations featured a "local" part that involves a direct dependence of the stress or curvature components on the temperature at the same point, and a "nonlocal" part, which reflects the effect of temperature of other points on the location of scrutiny. We also derive relations between the film stresses in each film and the system curvatures, which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary nonuniformities. These relations also feature a "nonlocal" dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. The interfacial shear tractions between the films and between the film and substrate are proportional to the gradient of the first curvature invariant, and can also be inferred experimentally.

Full-field measurement of nonuniform stresses of thin films at high temperature.

Full-field Measurement of Topography and Curvature by Coherent Gradient Sensing Method at High Temperature

Full-field Measurement of Surface Topographies and Thin Film Stresses at Elevated Temperatures by Digital Gradient Sensing Method

The Coherent Gradient Sensor for Film Curvature Measurements at Cryogenic Temperature

THIN FILM STRESSES MEASUREMENT AT ELEVATED TEMPERATURES BY DIGITAL GRADIENT SENSING METHOD

Coherent Gradient Sensing Method for Measuring Thermal Stress Field of Thermal Barrier Coating Structures

Stresses in a Multilayer Thin Film/Substrate System Subjected to Nonuniform Temperature

Modified Coherent Gradient Sensing Method for Slope Measurement of Reflective Surfaces

Multilayer Thin Films/substrate System with Variable Film Thickness Subjected to Non-Uniform Misfit Strains

Ultra-sensitive, Highly Reproducible Film Stress Characterization Using Flexible Suspended Thin Silicon Plates and Local Curvature Measurements

Special Considerations in Reflective Coherent Gradient Sensing Method for Measuring Large Deformations

A Highly Sensitive Local Curvature Metrology for Internal Stress Detection in Thin Films

Improvement of measurement error for modified coherent gradient sensing

Analysis and Improvement of Accuracy, Sensitivity, and Resolution of the Coherent Gradient Sensing Method.

Coherent Gradient Sensing Interferometry Technology and Its Application

The Application of Coherent Gradient Sensing Interference Measurement in Static Fracture Mechanics Experiments

A new method for high resolution curvature measurement applied to stress monitoring in thin films

Multiwavelength Shearing Interferometry for Measuring the Slopes, Curvatures, and Shapes of Thin Films/substrate Systems.

Multi-layer thin films/substrate system subjected to non-uniform misfit strains

The effect of thin film/substrate radii on the Stoney formula for thin film/substrate subjected to nonuniform axisymmetric misfit strain and temperature

Diffraction Grating Strain Gauge Method: Error Analysis and Its Application for the Residual Stress Measurement in Thermal Barrier Coatings