THIN FILM STRESSES MEASUREMENT AT ELEVATED TEMPERATURES BY DIGITAL GRADIENT SENSING METHOD
Feng,X,Zhang,CX,Qu,Z,Fang,XF,Hwang,KC,Gomes,JFS,Meguid,SA
2015-01-01
Abstract:Thin film stresses distribution in thin film/substrate systems at elevated temperatures, which results from the thermal mismatch strain between the film and substrate, usually decides the reliability and safety of such structures in microelectronic devices. The reflection mode of digital gradient sensing (DGS) method, a real-time full-field optical technique, is applicable to measure deformations of reflective surface topographies. In this paper, the reflection mode DGS method was developed for measuring topographies and thin film stresses of thin film/substrate systems at elevated temperatures. The air convection at elevated temperatures, which is a serious problem for optical techniques, is calibrated and compensated. The principles for surface topography measurements by the reflection-mode DGS method at elevated temperatures and the governing equations for removing the air convection effects are introduced in detail. The proposed method is applied to successfully measure the full-field topography and deformation of a NiTi thin film on a silicon substrate at elevated temperatures. The evolution of thin film stresses obtained by the extended Stoney's formula implies the "non-uniform" effect featured by the experimental results.