Abstract:The paper presents a study of surface acoustic waves propagation in a damage layer with finite thickness and residual stress on an orthotropic semi-infinite medium to reveal the application of laser ultrasound in the surface inspection of ground silicon wafers. Biot's theory of small deformations influenced by initial stress forms the basis for this study. Considering the case that the displacement and boundary forces are continuous at the interface and the forces vanish on the free surface, the required dispersion relation is obtained. We consider a sample of (100) silicon wafer by grinding with fine abrasive grains, which has a machined face with a micrometer-level thickness of surface damage and residual stress. In order to discuss the impact of propagation directions, degree of surface damage, residual compressive stress on the velocity characteristics of surface waves, the numerical computation of the dispersion equations is performed. It has been found that surface damage has a significant effect on the dispersion curve, while the residual compressive stress can only cause a small decrease Δc in the surface wave velocity. The velocity decrease Δc becomes obvious at high frequencies. For a fixed residual compressive stress and frequency, Δc hardly changes with the degree of surface damage and propagation directions. Based on the above characteristics, we study the inverse problem on detecting both surface damage and residual stress simultaneously by SAW velocities and give a corresponding iterative algorithm. This study may provide theoretical guidance for non-destructive testing of residual stress.

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Study on the Influence of Roughness on the Detection for Mechanical Characteristics of the Machined Surface by Surface Acoustic Wave Dispersion Theory

Method of Damage Characterization of Engineering Ceramics Grinding Surface

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Study on the relationship between the damage of machined surface layer and the dispersion curve of laser-induced surface acoustic wave

Evaluation of the surface damage of brittle materials based on the attenuation of laser-induced surface acoustic wave

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X-ray Scattering from a Rough Surface and Damaged Layer of Polished Wafers

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Quantifying the subsurface damage and residual stress in ground silicon wafer using laser ultrasonic technology: A Bayesian approach

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X-ray Diffraction Analysis of Damaged Layer During Polishing of Silicon Carbide

Inversion of surface damage and residual stress in ground silicon wafers by laser surface acoustic wave technology

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Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process

Study on Material Damage Process of Si under Rotating Disk Test

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