Effect of Annealing on Wet Etch of Amorphous IGZO Thin Film

Long-long Chen,Ji-feng Shi,Qian Li,Xi-feng Li,Jian-hua Zhang
DOI: https://doi.org/10.1007/s11741-011-0730-1
2011-01-01
Abstract:Amorphous InGaZnO (a-IGZO) film is deposited on the glass substrate by radio-frequency sputtering and the influence of annealing on wet etch of a-IGZO films were investigated. The results show that etch rate of IGZO films decrease with the increase of annealing temperature. Etching taper angle is less than 60° and critical dimension (CD) loss is less than 1 μm in over-etching time of 30 s. The fact implies that IGZO films etching with oxalic acid may be a good wet etching way for the thin-film transistor (TFT) array process.
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