Abstract:The major problem with quad flat no-lead package (QFN) packages is the delamination between the copper lead-frame and the molding compound (MC) due to relatively weak adhesion. The copper lead frame has excellent electrical and thermal conductivity. However, moisture penetration not only reduces the adhesion between the interfaces of the two materials, but also adversely affects the conductivity of Cu. Interface stratification is attributed to different material properties such as mismatch of coefficient of moisture expansion (CME), surface treatment of the mold pad, thermal strain, vapor pressure at high temperatures, and reduced interface strength due to moisture and temperature effects.The work presented in this paper focused on moisture, thermal and vapor pressure effects on the lead-frame and molding compound in the QFN during the precondition test and reflow process. The causes of delamination were examined both experimentally and via simulations. In an electronic package, the main failure effect stems from molding compound. To accurately simulate the moisture distribution in QFN, in this work, the moisture mechanism pertaining to material properties was investigated. This investigation focused on the MC and epoxy coefficient of moisture expansion and vapor pressure, and the parameters obtained by experimental study were incorporated into a simulation model to verify the fit between the experimental and the simulation findings. The electronic components employed in this work are standard for moisture sensitive testing, according to JEDEC J-STD-020D. To measure the specimen weight gain and geometric size, electronic balance and microscope were used, and these values were obtained under moisture sensitive level 1, level 2 and level 3 in order to establish the moisture desorption rate of the QFN package. And also according to the different degree of oxidation on the leadframe, the surface analysis of the material is carried out by environmental scanning electron microscope (ESEM) to understand the element distribution and interfacial strength. In addition, finite element analysis (FEA) was performed to analyze the stress, warpage and delamination in QFN packages. In this research will discuss the coupling forces of moisture, thermal stress and vapor pressure under MSL-3 and Reflow, and discuss the interface strength under different reliability test stages. To verify the accuracy of simulation modeling, the delamination site was observed and was aligned with the simulation results by applying scan acoustic tomography (SAT). Finally, the reliability of QFN was enhanced by investigating the moisture behavior of the materials co mprising the QFN.

Residual Stress Estimation Of Ncf-Bonded Cog Packages During Manufacturing Process

Evolution of Residual Stress Based on Curvature Coupling in Multi-Roll Levelling

Simulation and Experimental Analysis of Thermomechanical Stress Around Interconnects for W2W Hybrid Bonding

Stress analysis of interconnect structure in COF by finite element method

Residual Stress Concentration Due to Nano-Scaled Particulate Contamination at Direct Bonding Interface with Localized Material Inhomogeneity

Process Development of micro-bump flip chip bonding with Non-Conductive Film

Evaluation of the Effect of Stress Relief Slots on QFN Strip Warpage Using Finite Element Analysis

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

A Method to Measure Residual Stress of Liquid Molding Compound by In-Situ Characterizations

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

In-situ quantification of manufacturing-induced strains in fiber metal laminates with strain gages

Analytical Modeling of Residual Stress in Laser Powder Bed Fusion Considering Part’s Boundary Condition

Stress Monitoring in Flip Chip Packaging Process

Residual Stress Assessment of Interconnects by Slot Milling with Fib and Geometric Phase Analysis

Quantitative Modeling and Decoupling Method for Assembly Deformation Analysis Considering Residual Stress from Manufacturing Process

Molding Compound Effects on Warpage of Fan-out Wafer Level Packaging

Stress analysis of "Micro-Bump Bonding" structure for "Chip on glass" packaging

Residual stress variation in SiCf/SiC composite during heat treatment and its effects on mechanical behavior

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

Simulation and Analysis of Quad Flat No-lead Package (QFN) under Moisture, and Thermal Stress

A Manufacturing Process Simulation of Toughened Cyanate-Ester-Based Composite Structures with Respect to Stress Relaxation