Transient Thermal Analysis of Sealed Electromechanical Relay in Repeated Short-Term Operation System

Panwang Liang,Zhenbiao Li,Zhengjie He,Yun Liu
DOI: https://doi.org/10.3969/j.issn.1000-6753.2011.01.011
2011-01-01
Abstract:In order to better understand the temperature distribution of sealed electromechanical relay and its influence factors, a new modeling“space-filling-model”is introduced in this paper. The model can use one meshing model to simulate both close and open status through modifying the parameters of the filling material. Using software ANSYS, the paper simulates the transient temperature field of sealed electromechanical relay in the repeated short-term system. According to the calculation, the distribution of transient temperature field and its influence factors are summarized. Besides, the paper gives the relationship between the main heat source inside the relay and the current level. Finally, the paper puts forward an optimization method to decrease the temperature rise of the relay.
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