A study on the reliability of relay protection devices considering dynamic changes in temperature stress

GONG Jie,XU Xidong,YANG Jianyou,FANG Yudong
DOI: https://doi.org/10.19585/j.zjdl.202404011
2024-01-01
Abstract:Relay protection devices contain numerous electronic components,and environmental factors such as temperature,humidity,and vibration can impact their reliability.Addressing the complex dynamic changes in tem-perature stress experienced by protection devices installed in switchgear during operation,this study considers envi-ronmental temperature as a random variable following a normal distribution.Based on the Arrhenius model and the Weibull model,conditional probability density functions along with probability density functions of temperature stress distribution are used to derive the overall probability density function,reliability function,and failure rate function of protection devices.Through numerical computation,the study assesses the impact of changes in tempera-ture mean and variance parameters on the reliability of protection devices,providing a theoretical basis for reliabil-ity research on relay protection devices during field operation.
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