Abstract:Equal channel angular pressing (ECAP) not only affects the mechanical properties of pure copper but also the electrochemical behavior of copper. Thus, it would be interesting to perform a comprehensive analysis from a practical perspective. A three-dimensional (3D) simulation is carried out to reveal the strain distribution and field emission scanning electron microscopy (FESEM) is employed to investigate the microstructural evolution of copper in the course of six ECAP passes. It is found that the ECAP must be repeated enough times to bring about a significant grain refinement. This processing route will lead to observation of an ascending trend in all mechanical properties of copper except total elongation. The dislocation density shows the same ascending trend before it becomes saturated at the sixth pass. In order for copper to regain the usual homogeneity with respect to hardness, six ECAP passes are necessary. On the other hand, potentiodynamic polarization tests and electrochemical impedance spectroscopy (EIS) are all employed to understand the electrochemical behavior of ECAPed copper when immersed in 0.1 M NaOH solution. After the sixth pass, copper shows its best passive and protective behavior in this solution. Furthermore, Mott–Schottky analysis indicates that although the passive film of ECAPed copper still behaves as a p-type semiconductor, it becomes less defective or less conductive as the number of applied ECAP passes increase. Consequently, the most stable passive film forms on a copper sample that has gone through six passes of ECAP.

Mechanical Properties of Ultra-fine Grain Copper Produced by Equal Channel Angular Pressing (ECAP)

Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity

Tensile Deformation Behaviors of CuNi Alloy Processed by Equal Channel Angular Pressing

1216 Nano-Scale Strength Analysis by EBSD and AFM Hybrid Method in Ultrafine-Grained Copper Processed by ECAP

Effect of grain refinement on mechanical and electrochemical properties of severely deformed pure copper through equal channel angular pressing

Tensile and Compressive Deformation Behaviors of Commercially Pure Al Processed by Equal-Channel Angular Pressing with Different Dies

Microscopic Analysis by EBSD Method on Fatigue Crack Propagation Behaviour in Ultrafine-Grained Copper

Hardness and Texture of Electrolytic Copper Processed by ECAP at Ambient and Warm Temperature

Effect of original microstructure on microstructure and properties of pure copper subjected to equal channel angular pressing(ECAP)

Mechanical responses, texture and microstructural evolution of high purity aluminum deformed by equal channel angular pressing

Microstructure, texture and mechanical properties of pure copper processed by ECAP and subsequent cold rolling

Influence of Cold Rolling Routes on Mechanical Properties of Copper Subjected to ECAP

Effect of the Equal Channel Angular Pressing on the Microstructure and Phase Composition of a 7xxx Series Al-Zn-Mg-Zr Alloy

Effect of Sample Size on Microstructure and Mechanical Properties of OFHC Copper Processed by Equal Channel Angular Pressing

Effect of ECAP temperature on formation of triple heterogeneous microstructure and mechanical properties of Zn–1Cu alloy

Achieving High Strength and High Electrical Conductivity in a CuCrZr Alloy Using Equal-Channel Angular Pressing

Ebsp Investigation of Microstructure and Texture Evolution During Equal Channel Angular Pressing of Aluminium

Grain Refinement and Strengthening of an Aluminum Alloy Subjected to Severe Plastic Deformation through Equal-Channel Angular Pressing

Mechanical Properties and Microstructure of AZ31 Magnesium Alloy Processed by Intermittent Ultrasonic-Assisted Equal Channel Angular Pressing

Influence of ECAP as grain refinement technique on microstructure evolution, mechanical properties and corrosion behavior of pure aluminum

Effect of ECAP on microstructure uniformity and mechanical properties of high purity aluminum