Precision Measurement of Nanobeam Thickness Using Bending Test

徐临燕,栗大超,刘瑞鹏,傅星,胡小唐,张文栋
DOI: https://doi.org/10.3969/j.issn.1672-6030.2010.01.002
2010-01-01
Nanotechnology and Precision Engineering
Abstract:As nano thickness measurement with SEM and sidestep apparatus has the limitation of approximation and destructive effect,a precise measurement method for nanobeam thickness based on bending test was proposed.The key point of the proposed method is that a turning point will show up in the force-displacement curve of the suspending nanobeam under a load force when the lower surface of the beam contacts the substrate.The relative distance between the initial bending point and the turning point is the gap between the lower surface of the nanobeam and the substrate,and the thickness of the suspending nanobeam can be calculated consequently.Thickness of single-crystal silicon clamped nanobeam was measured using AFM and nanoindenter,which shows consistent measuring results.Effect of the random error,system error and calculation error on the measurement and corresponding ways to cure the errors have also been discussed.
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