Tunable Permittivity in High-Performance Hyperbranched Polyimide Films by Adjusting Backbone Rigidity
Xingfeng Lei,Mingtao Qiao,Lidong Tian,Yanhui Chen,Qiuyu Zhang
DOI: https://doi.org/10.1021/acs.jpcc.6b09332
2016-01-01
The Journal of Physical Chemistry C
Abstract:Currently, low-dielectric polyimides (PIs) such as fluorinated or porous PIs exhibit a low-dielectric property but have undesirable mechanical and/or thermal properties. Therefore, it is crucial to find a more considerate method that could lower the permittivity, while maintaining or improving the mechanical and thermal properties. Herein, a series of hyperbranched (HB) PI films were synthesized by adjusting the content of the rigid diamine, 2,2'-dimethylbenzidine (DMBZ). The dielectric properties of the HBPIs were accordingly tuned, that is, the permittivity of the resulting HBPIs decreased with increasing the DMBZ fraction owing to the enlarged free volume and the hindered dipole orientations afforded by the rigid DMBZ. The maximum mechanical strength of the resulting HBPIs located at the formulation made using 50% DMBZ and 50% ODA. At this formulation, the optimal comprehensive performances were achieved, that is, excellent tensile strength (124.1 MPa), desirable thermal stability (5% weight loss temperature up to 505 degrees C with weight residual of 56.7% at 800 degrees C under argon), high glass-transition temperature (324 degrees C), low relative permittivity (2.69, 1 MHz), reduced water absorption (similar to 1.86%), and good solubility. Our approach provides a new idea to fabricate low-dielectric PIs with good mechanical and thermal properties.