Dielectric Properties of Polyimide‐Mica Hybrid Films

YH Zhang,ZM Dang,JH Xin,WA Daoud,JH Ji,YY Liu,B Fei,YQ Li,JT Wu,SY Yang,LF Li
DOI: https://doi.org/10.1002/marc.200500310
IF: 5.006
2005-01-01
Macromolecular Rapid Communications
Abstract:Polyimide-mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N-dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical breakdown strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI-mica hybrid films decreases with the increase of the mica content at temperatures from -150 to 150 degrees C and at frequency range from 1 kHz to 1 MHz. It was found that the cryogenic electrical breakdown strength of the PI-mica hybrid films could meet the requirements of cryogenic insulating materials.
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