Simulation and Modeling of Polymeric Composite Temperature Change During Manufactory Process

陈祥宝,邢丽英,周正刚
DOI: https://doi.org/10.3969/j.issn.1005-5053.2009.02.013
2009-01-01
Abstract:Based on polymeric composite matrix curing dynamic equation,the curing reaction heat was introduced in the heat conductive equation via heat reaction dynamics.Temperature distribution models for polymeric material curing process were established by simulating the actual manufactory conditions.Compared between calculated values and actual values,it is found that the temperature distribution simulation technique for manufactory process can exactly predict epoxy and BMI polymeric composites temperature changes during manufactory.
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