Numerical Simulation of Temperature Distribution in the Glass Fiber Epoxy Composites during Microwave Curing

X. Zhang,X. L. Chang,R. L. Ma,L. Zhang,X. D. Chen,Q. Zhang
DOI: https://doi.org/10.1051/matecconf/201820603001
2018-01-01
MATEC Web of Conferences
Abstract:A three-dimensional coupled model of electromagnetic field, temperature field and curing degree field was established. Based on this model, the simulation of microwave curing process of glass fiber epoxy ring was realized, and the temperature distribution at different time was obtained. Numerical results indicate that the temperature difference within the composite ring is mainly formed in the initial stage during microwave curing.
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