Abstract:Polyimides (PI) are a class of dielectric polymer used in a wide range of electronics and electrical engineering applications from low-voltage microelectronics to high voltage isolation. They are well appreciated because of their excellent thermal, electrical, and mechanical properties, each of which need to be optimized uniquely depending on the end application. For example, for high-voltage applications, the final polymer breakdown field and dielectric properties must be optimized, both of which are dependent on the curing process and the final physico-chemical properties of PI. The majority of studies to date have focused on a limited set of properties of the polymer and have analyzed the effect of curing from a physicochemical-, mechanical- or electrical-centric viewpoint. This paper seeks to overcome this, unifying all of these characterizations in the same study to accurately describe the universal effect of the cure temperature on the properties of PI and at an industrial processing scale. This paper reports the widest-ranging study of its kind on the effect that cure temperature has on the physico-chemical, mechanical, thermal and electrical properties of polyimide, specifically poly (pyromellitic dianhydride-co-4, 4′-oxydianiline) (PMDA/ODA). The optimization of the cure temperature is accurately studied not only regarding the degree of imidization (DOI), but also considering the entire physical properties. Particularly, the analysis elucidates the key role of the charge–transfer complex (CTC) on these properties. The results show that while the thermal and mechanical properties improve with both DOI and CTC formation, the electrical properties, particularly at high field conditions, show an antagonistic behavior enhancing with increasing DOI while degrading at higher temperatures as the CTC formation increases. The electrical characterization at low field presents an enhancement of the final PI properties likely due to the DOI. On the contrary, at high electric field, the conductivity results show an improvement at an intermediate temperature emphasizing an ideal compromise between a high DOI and PI chain packing when the thermal imidization process is performed over this equilibrium. This balance enables maximum performance to be obtained for the PI film with optimized electrical properties and, overall, optimal thermal and mechanical properties are achieved.

Determining Thermal and Mechanical Properties of Polyimide Using the DIC Method

Mechanical, Dielectric, and Thermal Attributes of Polyimides Stemmed Out of 4, 4’–Diaminodiphenyl Ether

Polyimide/mica hybrid films with low coefficient of thermal expansion and low dielectric constant

Structure and Properties of Thermoplastic Polyimide Based on 4', 4'-(Oxybis (methylene)) Bis ([1.1'- Bipheny]3-Amine) Diamine

Thermophysical Properties of Carbon Modified Polyimide Composite Films

A STUDY ON CTE OF NANO-INORGANIC HYBRIDED POLYIMIDE USING DSCM

Near-Zero Thermal Expansion and High Heat-Resistance Polyimide Films Based on a Symmetric and Rigid Pyrazine Structure

Measurement of Coefficient of Thermal Expansion of Films Using Digital Image Correlation Method

Effect of Isomerism on Mechanical and Tribological Properties of Thermoplastic Polyimide Films

Enhanced thermal conductivity in copolymerized polyimide

Achieving Both Low Thermal Expansion and Low Birefringence for Polyimides by Regulating Chain Structures

Synthesis and properties of modified thermoplastic polyimide films with good dielectric properties at high frequency and enhanced thermal stability via incorporation of rigid ester and biphenyl structural units

Thermal, Mechanical and Dielectric Properties of Polyimide Composite Films by In-Situ Reduction of Fluorinated Graphene

A Universal Study on the Effect Thermal Imidization Has on the Physico-Chemical, Mechanical, Thermal and Electrical Properties of Polyimide for Integrated Electronics Applications

Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins

Preparation and properties of nano-SiC/polyimide composite films with low thermal expansion characteristic

Based on Rigid Xanthone Group and Hydrogen Bonding to Construct Polyimide Films with Low Coefficient of Thermal Expansion, High Temperature Resistance, and Fluorescent Property

Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates

High Performance Shape Memory Polyimides Based On Pi-Pi Interactions

Polyimide Films Based on β-Cyclodextrin Polyrotaxane with Low Dielectric and Excellent Comprehensive Performance

Effects of pre-imidization on rheological behaviors of polyamic acid solution and thermal mechanical properties of polyimide film: an experiment and molecular dynamics simulation