Semiaromatic Poly(ester Imide) Copolymers with Alicyclic Diamines for Low-K Properties at a High Frequency of 10–40 GHz
Meng-Chu Mi,Fu-En Szu,Ying-Chi Cheng,Cheng-Hang Tsai,Jia-Hong Chen,Jui-Hsiung Huang,Chi-Ching Kuo,Yan-Cheng Lin,Man-kit Leung,Wen-Chang Chen
DOI: https://doi.org/10.1021/acsapm.4c01405
2024-01-01
ACS Applied Polymer Materials
Abstract:Polyimide, a highly promising insulating material for high-frequency applications, has recently been the focus of attention. In particular, poly(ester imide) (PEI) has garnered significant interest due to its remarkably low dissipation factor (D-f < 0.002 @ 10 GHz) and coefficient of thermal expansion (CTE < 20 ppm K-1). However, its relatively high dielectric constant (D-k > 3.0 @ 10 GHz) has posed a challenge for its use in high-frequency flexible circuit boards. This study presents the approach by introducing a series of alicyclic diamines with varying steric hindrances into the PEI backbone to disrupt the molecular chain stacking and reduce PEI's D-k. The copolymerization of PEIs with a series of alicyclic diamines, including 1,4-cyclohexane diamine, 1,4-bis(aminomethyl) cyclohexane, 4,4 '-methylenebis (cyclohexylamine), bis(aminomethyl)norbornane, tricyclodecane diamines (TCDDA), has yielded promising results. Notably, TCDDA, a value-added chemical derived from a well-known petroleum waste of dicyclopentadiene, has shown significant potential. The results demonstrate that introducing flexible methyl linkers, bicyclic rings, bridged rings, or fused rings effectively reduces D-k by increasing the steric hindrance. Importantly, PEIs can maintain low D-f and decent thermal and mechanical properties. Among them, PEI with 10 mol % TCDDA demonstrates excellent properties, including a glass transition temperature higher than 380 degrees C, low CTE of 15.7 ppm K-1, high ultimate tensile strength of 132.4 MPa, high elongation at break of 8.5%, and low D-k (2.88/2.67) and D-f (0.0019/0.0025) at 10/38 GHz. The steric hindrance generated by TCDDA achieves an optimal balance in thermal, mechanical, and dielectric properties, making it a promising low-dielectric insulating layer for next-generation communication.