Abstract:Semiconducting single-walled carbon nanotube (s-SWNT) arrays attract much attention due to the ideal configuration for high performance electronics. A recent approach based on the nanoscale thermocapillary flow enabled the achievement of aligned arrays of highly purified s-SWNTs by removing the metallic SWNTs (m-SWNTs) in as-grown arrays by direct pulsed current injection. Thermal management of this process is critically important since the cumulative heating from the m-SWNT array yields a high temperature increase to cause the difficult control of thermocapillary flow. In this paper, an analytical heat transfer model combining a two-dimensional transient thermal model and a three-dimensional steady state thermal model is established for predicting the temperature increase of the SWNT array under a pulsed current injection with a period step function. The analytical predictions agree well with three-dimensional finite element analysis. Effects of parameters (such as duty cycle, period, spacing, etc.) on the temperature distributions and the maximum temperature increase are investigated systematically. These results can help guide the purification process to reduce the adverse thermal effects to obtain highly purified s-SWNTs.

Transient electro-thermal analysis of single-walled carbon nanotube (SWCNT) with transmission line model

Electrothermal Characterization of Single-Walled Carbon Nanotube (SWCNT) Interconnect Arrays

Electrothermal Characterization of Carbon Nanotube Field Effect Transistors (Cntfets)

Investigation on self-heating effect in carbon nanotube field-effect transistors

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Temperature Effects on Crosstalk in Carbon Nanotube Interconnects

Modeling of carbon nanotube (CNT) interconnects

Electrothermal investigation on through silicon multi-walled carbon nanotube via interconnects

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Modeling of Carbon Nanotube Interconnects and Comparative Analysis with Cu Interconnects

Electromagnetic Compatibility-Oriented Study on Through Silicon Single-Walled Carbon Nanotube Bundle Via (TS-SWCNTBV) Arrays

Electrothermal modelling of novel through-silicon carbon nanotube bundle vias (TS-CNTBV)

Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects

Circuit Modeling and Time Delay Analysis of Double-Walled Carbon Nanotube Interconnects

An Electrothermal Model of Interconnects Based on a Transmissionline Network

Quantitative Thermal Imaging of Single-Walled Carbon Nanotube Devices by Scanning Joule Expansion Microscopy.

Molecular dynamics simulation of thermal conductivity of single-wall carbon nanotubes

Fast Crosstalk Analysis of Multi-Walled Carbon Nanotube Interconnects

Study on equivalent single conductor model of multi-walled carbon nanotube interconnects

Thermal Management for Purification of Aligned Arrays of Single-Walled Carbon Nanotubes Based on Thermocapillary Flow by Pulsed Heating

Electrothermal Characterization of Multilevel Cu-Graphene Heterogeneous Interconnects in the Presence of an Electrostatic Discharge (ESD)