Micro Thermal Shear Stress Sensor Based On Vacuum Anodic Bonding And Bulk-Micromachining

Liang Yi,Liang Ou,Shi Sha-Li,Jin Ma,Chen Da-Peng,Ye Tian-Chun
DOI: https://doi.org/10.1088/1674-1056/17/6/031
2008-01-01
Chinese Physics B
Abstract:This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2 mu mx100 mu m, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200 mu mx200 mu mx400 mu m, is placed between the silicon nitride diaphragm and glass (Corning 7740). This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.
What problem does this paper attempt to address?