Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

COHERENT GROWTH OF Α-W FILM ON Si WAFER AND ITS THICKNESS DEPENDENT MECHANICAL AND ELECTRICAL PROPERTIES

Template-induced Formation of Α-W and Size-Dependent Properties of Tungsten Thin Films

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Study of Tungsten Deposited on Amorphous Si, Si (111) and Sio2 Using Direct-Current Magnetron Sputtering

Insights into the Nucleation, Grain Growth and Phase Transformation Behaviours of Sputtered Metastable Β-W Films

PHYSICAL PROPERTIES OF WEDGE-SHAPED Al THIN FILM

Shrunk Lattice Structure and Interdiffusion Characteristics of 5 Nm Thick Al(2)O(3) Ultrathin Films Sputtered on Silicon.

SURFACE MORPHOLOGY AND GROWTH MECHANISM OF THE Al FILMS DEPOSITED ON LIQUID SURFACES

Influence of Substrates on the Microstructure and Electrical Properties of Si/Mo Thin Films

Growth and Morphology of Ultra-Thin Al Films on Liquid Substrates Studied by Atomic Force Microscopy

Heterogeneous Morphologies and Hardness of Co-Sputtered Thin Films of Concentrated Cu-Mo-W Alloys

Structural and electrical properties of fiber textured and epitaxial molybdenum thin films prepared by magnetron sputter epitaxy

Study on Microstructure and Mechanical Properties Of（alcrtizrnb）n/al2o3 Nano-multilayer Film

The Surface Mapping and Crystal Orientation of Body-Centered Cubic Thin Metal Tungsten Films of Different Thickness

GROWTH AND STABILITY OF ULTRA-THIN Pb FILMS ON Pb/Si(111)-α-√3 × √3

Individual Layer Thickness Dependence of Microstructure and Mechanical Properties of Magnetron Sputtering Mo-W-Doped Ni/Ni3Al Multilayers

Tailoring the Structure of Al50Mo50 Alloy Films Towards Realizing the Well Match Between Mechanical and Electrical Performance by Controlling the Growth Mode

Annealing Effect on the Contact Angle, Surface Energy, Electric Property, and Nanomechanical Characteristics of Co40Fe40W20 Thin Films

The growth mode of α-Fe2O3 thin films by DC magnetron sputtering

Microstructure and stress evolution of W nanofilms prepared by arc ion plating under different deposition time and substrate bias

The Properties of a-C∶ H (Al, W) Films Prepared by Medium Frequency Magnetron Sputtering