Effect of Different Deposition Rates on the Growth of SiC on Si by SSMBE

刘忠良,刘金锋,任鹏,徐彭寿
DOI: https://doi.org/10.13922/j.cnki.cjovst.2008.04.008
2008-01-01
Abstract:The SiC films were grown by solid-source molecular beam epitaxy (SSMBE) at different deposition rates on Si(111) substrate. Its microstructures and properties were characterized with reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), and atomic force microscopy (AFM). The results show that the deposition rate significantly affects the quality and microstructures of the SiC films. 1.0 nm·min-1 was found to be the optimized deposition rate, below which, say at a rate of 0.25 nm·min-1, high density of voids form through which Si atoms may easily diffuse; but above which, say at a rate of 1.8 nm·min-1, coalescence of islands and clusters occur, resulting in high surface roughness, or worse, formation of polycrystalline SiC.
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