Theoretical analysis and numerical simulation on the fracture of GaN epitaxial films

YunFei Shi,Jianlin Liu,Xiqiao Feng
2007-01-01
Abstract:The big thermal mismatch between the GaN film and Si substrate in the cooling process after the heterogeneous epitaxial growth at high temperature causes the high residual stresses in the film layer and may lead to the fracture of the film. In the present paper, the fracture of the film caused by the residual stresses was investigated by theoretical analysis and finite element numerical simulation. The results show that the magnitude of the maximal residual stress is proportional to the Young's modulus of GaN, the difference of thermal coefficients between the film and substrate, and the temperature change during cooling. The width-thickness ratio has a significant influence on the distribution of thermal residual stresses. The maximal crack-free width for the 0.7 μm thick GaN film is estimated to be about 11 μm.
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