A Bulk Micromachined Gyroscope With Improved Quality-Factors At Atmospheric Pressure

Chen Weiping,Chen Hong,Liu Xiaowei,Han Tian,Wang Hao

DOI: https://doi.org/10.1117/12.779200

2007-01-01

Abstract:This paper presents a bulk micromachined gyroscope with fully symmetric and doubly decoupled structure. The fully symmetric structure enables matched resonant frequencies of the drive and sense modes. The doubly decoupled mechanism, which reduces the cross-coupling and the quadrature error, is realized by independent and folded suspensions for restricting the drive and sense moveable fingers' degree of freedom (DOF). Additionally, the gyroscope has large quality factors even operating at atmospheric pressure, which is designed by utilizing slide film damping effects in drive and sense modes. Simulation results show that the resonant frequency for the drive and sense modes are 2776Hz and 2777Hz, respectively, and the cross-coupling is less than 0.2%. The gyroscope chip is fabricated by silicon-glass anodic bonding and deep reactive ion etch (DRIE) technology. The fabricated gyroscope has a structure thickness of 80 mu m and a whole chip size of 5.5x5.5 mm(2). The gyroscope has a static sense capacitance of 3.5 pF with minimum capacitive gaps of 4 mu m. The measured resonant frequency with damping is 2581 Hz with the quality factor of 195 at atmospheric pressure.