A Bulk Micromachined Vibratory Lateral Gyroscope Fabricated With Wafer Bonding And Deep Trench Etching

Zh Li,Zc Yang,Zx Xiao,Yl Hao,T Li,Gy Wu,Yy Wang
DOI: https://doi.org/10.1016/S0924-4247(99)00375-1
2000-01-01
Abstract:A bulk micromachined vibratory lateral gyroscope, which is fabricated with Silicon-glass wafer bonding and deep trench etching, has been developed. By using entirely symmetric springs, drive mode and sense mode frequencies of the gyroscope are matched precisely, which is important to improve sensitivity. The gyroscope has a large mass and capacitance, and its thermal-mechanical noise floor is estimated to be about 0.05 degrees/h/Hz(1/2). (C) 2000 Elsevier Science S.A. All rights reserved.
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