THE IMPACT OF IMPURITIES ON MINORITY CARRIER LIFETIME OF MULTICRYSTALLINE SILICON

Hai Deng,Deren Yang,Jun Tang,Zhenqiang Xi,Duanlin Que
DOI: https://doi.org/10.3321/j.issn:0254-0096.2007.02.008
2007-01-01
Abstract:The minority carrier lifetime (τ) scan mapping along the multicrystalline ingot was obtained by means of Microwave Photo Conductive Decay (μ-PCD). The lifetime measurements exhibit a width of the degraded regions of the order of 4-5 centimeters at the bottom and about 2 cm at the top of the ingot, while a large uniform with high lifetime zone exist in the central position. By measuring the r before and after sample annealing at 200°C for 10 minutes, the interstitial iron concentration can be evaluated. The results show that there is a strong increase towards both the top and the bottom of the ingot, and this is attributed to the solid-state diffusion from the crucible after crystallization and the segregation into the molten phase. The profile of interstitial oxygen concentration was investigated by FTIR, the results show that the concentration of oxygen decreases from the bottom to the top of the ingot, which is dominated mainly by the segregation mechanism. The high concentration of impurities such as iron and oxygen, which can induce electrically active recombination centers, is believed to be responsible for the lifetime reduction in the two sides of the ingot.
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