Properties of Multicrystalline Silicon Wafers Based on UMG Material

Tingting Jiang,Xuegong Yu,Xiaoqiang Li,Xin Gu,Peng Wang,Deren Yang
DOI: https://doi.org/10.1149/1.3567722
2011-01-01
ECS Transactions
Abstract:In this paper, we have studied various properties of UMG silicon wafers by combining four-point probe, microwave photo-conductance decay (μ-PCD), Fourier transform infrared (FTIR) spectroscopy,Inductively coupled plasma-mass spectrometry (ICP-MS) and optical microscopy techniques. The results show that the resistivity and the minority-carrier lifetime of UMG silicon are lower than that of standard multicrystalline material, while the detrimental interstitial iron concentration is larger. The concentration of substitutional carbon, interstitial oxygen and dislocation density are close to that in the standard multi-crystalline silicon. Furthermore, a phosphorous gettering has been used to improve the quality of UMG samples. It is found that phosphorus gettering in UMG silicon can increase the minority carrier lifetime and reduce the interstitial iron concentration. But, the minority-carrier lifetime is still not as high as the conventional/standard silicon counterpart after gettering. These results will help us to better understand the properties of UMG silicon wafer.
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