Abstract:Recently, due to the promising properties of silver, the low-temperature silver sintering joining technology has become increasingly attractive in power electronics. Reliable bonding quality of sintered silver depends not only on the microstructure, but also on the interfacial properties to the joining materials. Sintering on precious metal surfaces such as silver or gold works very well due to the good interdiffusion behavior of these elements. Non-precious metal surfaces such as copper are preferred to reduce manufacturing costs as no additional surface metallization layer is required. Sintering on copper surfaces is usually performed in a nitrogen atmosphere, as they can potentially oxidize during sintering in an oxygen -containing atmosphere. The resulting copper oxide is proposed to act as a diffusion barrier, resulting in weak bonding of the silver compound to the copper surface. In this work, we observed that not only the substrate oxidation during sintering, but also the initial Cu oxide layer affects the bonding performance. Therefore, different copper oxidation methods were performed to produce different types of copper oxides and thicknesses on active metal brazed (AMB) substrates. X-ray photoelectron spectroscopy (XPS) measurements of the samples indicate the presence of two types of copper oxides, which further affect the bond strength of sintered Ag differently. Pressure sintering with micron Ag paste on a nearly oxide-free copper surface produces lower bond strength than sintering on oxidized substrates. The highest bond strength can be achieved on CuO, but the presence of Cu20 also contributes to the bonding of silver to the copper surface. If the oxide layer becomes too thick, bonding is no longer guaranteed. Higher sintering temperature and pressure results in a denser sintered layer and stronger bonding on copper substrates.

Fabrication research of silver copper oxide composite reactive synthesis

Microstructure and Service Life of Silver Copper Oxide Contact Materials after Reactive Synthesis Fabrication and Severe Plastic Deformation

Effects of Preparation Method on Microstructure and Electrical Contact Performance for AgCuO Composites

Fabrication and performance of silver coated copper powder

Microstructure Compared of AgSnO2 and AgCuO Composites by Reactive Synthesis Fabrication

Influences of Tin Oxide Surface Modification on the Morphology and Performance of Sintered Ag/SnO2 Composite Powders

In Situ Fabrication and Static Contact Resistance of CdMoO4 Reinforced Cu Matrix Composites

Microstructure and properties of Y2O3/Cu composites fabricated by a novel liquid phase in situ reactive synthesis process

Optimization of Cyanide-Free Composite Electrodeposition Based on π-π Interactions Preparation of Silver-Graphene Composite Coatings for Electrical Contact Materials

Synthesis and Characterization of Silver-Coated Copper Powder Layer

Processing copper and silver matrix composites by electroless plating and hot pressing

Preparation and sintering properties in air of silver-coated copper powders and pastes

Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance

Investigation on Microstructure and Properties of Cu–Al2O3 Composites Fabricated by a Novel In-Situ Reactive Synthesis

Interface Structure of Ag/SnO2 Nanocomposite Fabricated by Reactive Synthesis

A Study of Silver Decoration on Carbon Nanotubes via Ultrasonic Chemical Synthesis and Their Reinforced Copper Matrix Composites

Preparation and anti-oxidisation resistance of silver-coated copper powders by cobalt-modified copper powders

Microstructure and property of electroformed nano-Al2O3/Cu composite

Preparation of silver-coated copper powder and its oxidation resistance research

A facile fabrication of Ag/SiC composite coating with high mechanical properties and corrosion resistance by electroless plating

Fabrication Techniques and Research Situation of Cu-Al2O3 Composites