Abstract:Effects of silver content (5–35 wt %), sintering temperature (150–850 °C), sintering time (30–180 min), and compaction pressure (200, 300, and 400 MPa) were studied on characteristics of prepared contacts. XRD (X-Ray Diffraction), OM (Optical Microscope), SEM (Scanning Electron Microscope), and electrical resistance analyses were used to study the properties of the contacts. The Results showed that increasing the percentage of silver in the contacts as well as increasing the time and temperature of the sintering process increase the oxidation of copper. It was found that galvanic corrosion and the Kirkendall effect between Cu and Ag (especially in high silver content) resulted in the formation of microvoids around the copper particles facilitating the copper oxidation. Apparent bulk density remained almost constant as the sintering temperature increased from 150 to 700 °C, while it dropped sharply in a sintering temperature of 750 and 800 °C. It was determined that increasing the sintering time from 30 to 60 min increases the apparent bulk density, while increasing the sintering time to more than 60 min reduces it. Moreover, increasing the amount of compaction pressure in 200–400 MPa did not affect the apparent bulk density. The electrical resistance is almost independent of sintering temperature in 25 °C–700 °C. Further change in sintering temperature from 700 to 750 °C raised the electrical resistance from 0.2 Ω to 15 kΩ. A Study of the electrical resistance of the samples indicated that increasing the Ag content up to 25 wt% reduces the electrical resistance. The electrical resistance of the sample containing 35 wt% Ag was 14 kΩ that which was higher than that of the sample containing 25 wt% Ag (0.11 Ω).

Effects of Preparation Method on Microstructure and Electrical Contact Performance for AgCuO Composites

Fabrication research of silver copper oxide composite reactive synthesis

Microstructure and Service Life of Silver Copper Oxide Contact Materials after Reactive Synthesis Fabrication and Severe Plastic Deformation

Influences of Tin Oxide Surface Modification on the Morphology and Performance of Sintered Ag/SnO2 Composite Powders

Preparation by Different Methods and Characterization of Ag/ZnO Composite for Application in Electrical Contact Materials

Effects of Cr addition on the microstructural, mechanical and electrical characteristics of Cu–6wt.%Ag microcomposite

Effects of pre-annealing process on microstructure and properties of the Cu-12%Ag composite wire

Microstructure evolution and properties of Cu–Ag microcomposites with different Ag content

Influences of Metal Oxide Additions on the Morphology of Sintered AgSnO2 Composite Powders

Sintering Densification of Cu/Al2O3p Nano-Composite Powders by Electroless Copper Plating

EFFECTS OF Ag CONTENT ON MICROSTRUCTURE AND PROPERTIES OF THE FILAMENT STRENGTHENED Cu-Ag ALLOYS

Preparation of Cubic Zinc Stannate Nanopowder and Its Application in Silver-Based Electrical Contact Material

Preparation and Properties of Perovskite La1-xSrxCoO3-delta Powders and Ag-LSCO Electrical Contact Composite Materials

Effect of the impurity in electroless plated Powders on morphology and properties of sintered AgSnO2 materials

Preparation of Ag-Al2O3 nano-composites powder

Effects of Ag Shell on Electrical, Thermal and Mechanical Properties of Cu@Ag Composite Solder Preforms by Electromagnetic Compaction for Power Electronics

Microstructure and Properties of Cu-Fe-Ag In-Situ Composites

Effect of preparing method of ZnO powders on electrical arc erosion behavior of Ag/ZnO electrical contact material

Microstructure and properties of Y2O3/Cu composites fabricated by a novel liquid phase in situ reactive synthesis process

Physical and chemical properties of Ag–Cu composite electrical contacts prepared by cold-press and sintering of silver-coated copper powder

Effect of Powder Preparation Techniques on Microstructure, Mechanical Properties, and Wear Behaviors of Graphene-Reinforced Copper Matrix Composites