Abstract:Electronically conductive adhesives (ECAs) are commonly used in IC and LED packaging. Copper (Cu) powders can be applied to ECAs as conductive filler. Micron-sized Cu powders has many excellent physical properties and catalytic activity. However, after the Cu powders has been microfined, it is easily oxidised to cuprous oxide in air due to the large specific surface area of the Cu particles and their high chemical activity. The silver-coated copper (Cu@Ag) powders is formed by Ag plating on the surface of the Cu powders, which not only improves the oxidation resistance of Cu, but also maintains the excellent electrical conductivity of Cu. During the replacement reaction, the dotted Ag is the positive electrode of the micro-battery, and the Cu that has not been replaced on the surface is the negative electrode. Ag ions can be reduced and deposited on Cu powder by chemical substitution reaction. Economically, Cu@Ag powders as filler can not only enhance the performance of ECAs but also reduce the cost of ECAs. The SEM image of Cu@Ag shows a high Ag content of 90 wt% on the surface of Cu as can be seen by the EDS spectrum. The oxidation of Cu powders can be effectively inhibited by plating Ag on Cu surface and play a great role in the oxidation resistance of Cu. Moreover, the application of Cu@Ag powders with different morphologies promoted the curing of ECAs. Under the optimal curing process, ECAs’ bulk resistivity was 21.27×10 -3 Ω•cm, 3.27×10 -3 Ω•cm, and the shear strength was 17.66 MPa, 12.24 MPa when adding 75 wt% spherical and flaky Cu@Ag powders, respectively. When filled with two different shapes of Cu@Ag powders, the ECA had a bulk resistivity of 1.75×10 -3 Ω•cm and a shear strength of 20.39 MPa. The better comprehensive performance of the bi-component ECAs was proved.

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