Abstract:For power electronics packaging, die attach materials are developing towards higher working temperature and higher current density. Traditional packaging materials such as solder paste and conductive adhesives no longer meet the requirements of advanced packaging, especially for wideband gap chip packages. Copper-silver core-shell (Cu@Ag) particle is an emerging material that can be used for advanced packaging. It combines the excellent electrical and thermal conductivity of copper and silver particles, while avoiding the shortcomes such as the electromigration of silver and the oxidation of copper. The sintered paste prepared by Cu@Ag has excellent electrical and thermal conductivity and is low in cost compared with commercial silver sintered paste, which has attracted the interest of researchers and companies all over the world. In this work, Cu@Ag particles preparation methods, paste preparation, and sintering process were listed and compared. Furthermore, molecular simulations regarding such core-shell particles were also concluded. The main preparation methods of Cu@Ag particles include physical vapor deposition, spray pyrolysis, direct displacement, liquid-phase chemical reduction, etc. Commonly used sintering methods for Cu@Ag sintering paste include hot pressing sintering, ultrasonic assisted sintering, and pulse current sintering. Copper-silver core-shell nanoparticles have a larger radius of curvature between the grain boundaries than bulk materials due to their smaller size, and the sintering temperature is greatly reduced, so the sintering kinetics is also different from that of bulk materials. The molecular dynamics simulation (MD) software LAMMPS can simulate the particle sintering process and explore the sintering mechanism.

Solvent Modulation, Microstructure Evaluation, Process Optimization, and Nanoindentation Analysis of Micro-Cu@ag Core–shell Sintering Paste for Power Electronics Packaging

Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures

Review of Copper-Silver Core-Shell Sintering Pastes: Technology and Future Trends

Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

Investigation of Ethylene Glycol, Α-Terpineol, and Polyethylene Glycol 400 on the Sintering Properties of Cu–Ag Core–shell Micro/nano-Mixed Paste

Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging

Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging

Sintering Mechanism of a Supersaturated Ag-Cu Nanoalloy Film for Power Electronic Packaging

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

Shape Synergy of Ag@Cu Chip Packaging Nano‐Paste and Its Sintering Reliability

A Supersaturated Cu-Ag Nanoalloy Joint with Ultrahigh Shear Strength and Ultrafine Nanoprecipitates for Power Electronic Packaging

Efficient Synthesis and Excellent Performance of Low-Temperature Sintering Cu@Ni Nanoparticle Materials for Power Electronic Packaging

Fabrication Of A Hybrid Paste Consisting Of Microscale Ag-Plated Cu Flakes And Nanoscale Ag Particles And Characterization Of Low-Temperature Sintered Hybrid Paste Joints

Research Progress of Cu Nanoparticle Sintering Technology for Power Electronic Packaging

A low cost multi-shapes designed sintering composite paste: A strengthening method of sintered interconnect for die attach in high temperature applications

Superb Sinterability of the Cu Paste Consisting of Bimodal Size Distribution Cu Nanoparticles for Low-Temperature and Pressureless Sintering of Large-Area Die Attachment and the Sintering Mechanism

Large-area Die Attachment and the Surface Finish Effect on Bonding Strength of Joints in High-power Electronics Using a Low-temperature Sinterable Cu Nanoparticle Paste

A Novel Cu@Ag Nano Paste with Low Porosity for Rapidly Sintering in Air Condition

An SEM-Based Finite Element Analysis of Cu-Ag Sintered Joints on Thermal Shock Reliability