Abstract:With the dramatic requirements of high power and high integrity in field of power devices, the study of novel interconnection materials and packaging methods has been paid an extremely attention. Presently, the most candidates for the chip bonding are Zn-based, Bi-based, noble-metal-based (such as Au-Sn, Au-Ge, Au-Si), nano-metal particles (Ag or Cu nanoparticles) and transient-liquid-phase (TLP) bonding. However, a high bonding temperature and poor ductility for Zn-based solder (more than 420°C) causing irreversible damages or accelerated aging affects to the electronic devices; Bi-based solder alloys are still under way mainly due to their inferior thermal and electrical conductivity as well as poor workability; It's worth noting that nano-silver sintering and TLP bonding technology have been proven to be the potential solutions to the power electronic packaging, because their processing temperatures are relatively low and the produced joints are of high re-melting temperatures. However, Ag is expensive and easy to electromigration, which will influence the stability/reliability of the joints and hinder to universal industry applications. For the TLP bonding, the process to produce full intermetallic compounds (IMCs) is time-consuming, commonly more than 60 min, due to relatively low reaction velocity. To solve the problem of time-consuming of the TLP, an enhanced and low-cost auxiliary energy is necessary. Ultrasonic-assisted soldering has been proven able to solder dissimilar metals at low temperatures within a very short time. In our previous work, a full Cu6Sn5/Cu3Sn IMCs joint through TLP assisted by ultrasound was obtained. Because of the acoustic cavitation and streaming effect created by ultrasonic waves propagating in molten alloys, the atom diffusion and physical-chemical interactions were accelerated at the liquid/solid interfaces. However, a sole IMC joint with single phase has not been fabricated so far. High re-melting temperature joint consisted of nearly sole Ni 3 Sn 4 with a high shear strength of 43.4 MPa was achieved with Sn-24 wt.%Ni by ultrasonic-assisted soldering for 10 s. This rapidly formed intermetallic joint was phase-stable as isothermally aged at 300 °C for 72 h in air and its shear strength was 33.4 MPa due to the Ni 3 Sn 4 grains coarsening. These results demonstrate that the less time-consuming ultrasonic-assisted soldering has wide potentials for high-temperature power electronic packaging.

Solder Preforms Composed of High Cu-content Sn-xCu Alloys for Power Electronic Packaging and Characterization of the Processing Performance and Joint's Properties

Novel Sn-Cu Based Composite Solder Preforms Capable of Low Temperature Reflow for Die Attachment of High Temperature Power Electronics and the Transient Liquid Phase Bonding Process

Revealing the Strengthening Mechanism of Cu–Sn Composites Joint Fabricated Via In-Situ Reaction for Power Electronic Packaging

Cu3sn Joint for Power Devices - Prepared by Cu@Cu6sn5 Submicron Particles

Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications

Rapid Formation of Intermetallic Joints with Sn/metal Composite Alloys by Ultrasonic-Assisted Soldering for High-Temperature Chip Attachment

Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging

Investigation of Soldering Process and Interfacial Microstructure Evolution for the Formation of Full Cu3Sn Joints in Electronic Packaging

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

Sn-Coated Cu Microparticle Paste For High Power Device Packaging

Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Facile preparation of Cu foam/Sn composite preforms for low-temperature interconnection of high-power devices

Fabricating processand microstructure evolutionof Cu/Cu3Sn/Cu solder joints in electronic packaging

Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics

Accelerated solid-liquid interdiffusion bonding of Cu joint using a Cu10Ni alloy mesh reinforced SAC305 composite solder

Preparation and Sintering Properties of Cu10Sn3 IMCs Nanopaste As Die Attach Material for High Temperature Power Electronics

Ni3Sn4-composed Die Bonded Interface Rapidly Formed by Ultrasonic-Assisted Soldering of Sn/Ni Solder Paste for High-Temperature Power Device Packaging

Fabrication of Cu@Sn Core-Shell Structured Particles and the Application in High Remelting Temperature Bonding

Cu3Sn Joint Based on Transient Liquid Phase Bonding of Cu@Cu6Sn5 Core–shell Particles

Micron Sn-Cu Composite Solder for High-Temperature Applications Based on Transient Liquid Phase Bonding