Abstract:With the dramatic requirements of high power and high integrity in field of power devices, the study of novel interconnection materials and packaging methods has been paid an extremely attention. Presently, the most candidates for the chip bonding are Zn-based, Bi-based, noble-metal-based (such as Au-Sn, Au-Ge, Au-Si), nano-metal particles (Ag or Cu nanoparticles) and transient-liquid-phase (TLP) bonding. However, a high bonding temperature and poor ductility for Zn-based solder (more than 420°C) causing irreversible damages or accelerated aging affects to the electronic devices; Bi-based solder alloys are still under way mainly due to their inferior thermal and electrical conductivity as well as poor workability; It's worth noting that nano-silver sintering and TLP bonding technology have been proven to be the potential solutions to the power electronic packaging, because their processing temperatures are relatively low and the produced joints are of high re-melting temperatures. However, Ag is expensive and easy to electromigration, which will influence the stability/reliability of the joints and hinder to universal industry applications. For the TLP bonding, the process to produce full intermetallic compounds (IMCs) is time-consuming, commonly more than 60 min, due to relatively low reaction velocity. To solve the problem of time-consuming of the TLP, an enhanced and low-cost auxiliary energy is necessary. Ultrasonic-assisted soldering has been proven able to solder dissimilar metals at low temperatures within a very short time. In our previous work, a full Cu6Sn5/Cu3Sn IMCs joint through TLP assisted by ultrasound was obtained. Because of the acoustic cavitation and streaming effect created by ultrasonic waves propagating in molten alloys, the atom diffusion and physical-chemical interactions were accelerated at the liquid/solid interfaces. However, a sole IMC joint with single phase has not been fabricated so far. High re-melting temperature joint consisted of nearly sole Ni 3 Sn 4 with a high shear strength of 43.4 MPa was achieved with Sn-24 wt.%Ni by ultrasonic-assisted soldering for 10 s. This rapidly formed intermetallic joint was phase-stable as isothermally aged at 300 °C for 72 h in air and its shear strength was 33.4 MPa due to the Ni 3 Sn 4 grains coarsening. These results demonstrate that the less time-consuming ultrasonic-assisted soldering has wide potentials for high-temperature power electronic packaging.

Preparation and Sintering Properties of Cu10Sn3 IMCs Nanopaste As Die Attach Material for High Temperature Power Electronics

Facile Synthesis of Cu10Sn3 Nanoparticles and Their Sintering Behavior for Power Device Packaging

Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging

Solder Preforms Composed of High Cu-content Sn-xCu Alloys for Power Electronic Packaging and Characterization of the Processing Performance and Joint's Properties

Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging

Efficient Synthesis and Excellent Performance of Low-Temperature Sintering Cu@Ni Nanoparticle Materials for Power Electronic Packaging

Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application

Ag-Sn Bimetallic Nanoparticles Paste for High Temperature Service in Power Devices

Highly Conductive Cu-Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

Superb Sinterability of the Cu Paste Consisting of Bimodal Size Distribution Cu Nanoparticles for Low-Temperature and Pressureless Sintering of Large-Area Die Attachment and the Sintering Mechanism

Cu3sn Joint for Power Devices - Prepared by Cu@Cu6sn5 Submicron Particles

Preparation and Sintering Properties of Ag27Cu2Sn Nanopaste As Die Attach Material

Rapid and Low Temperature Sintering Bonding Using Cu Nanoparticle Film for Power Electronic Packaging

Large-area Die Attachment and the Surface Finish Effect on Bonding Strength of Joints in High-power Electronics Using a Low-temperature Sinterable Cu Nanoparticle Paste

Mechanical Property Of Cu-Sn-Ni Intermetallics In The Full Intermetallic Micro-Joints Formed With Transient Liquid Phase Soldering

Rapid Formation of Intermetallic Joints with Sn/metal Composite Alloys by Ultrasonic-Assisted Soldering for High-Temperature Chip Attachment

Research Progress of Cu Nanoparticle Sintering Technology for Power Electronic Packaging

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Facile Synthesis of Cu-Sn Nanoparticle Film and Its Bonding Mechanism for Power Electronic Packaging

Superior Strength and Strengthening Mechanism of Die Attachment Joints by Using Bimodal-Sized Cu Nanoparticle Paste Capable of Low-Temperature Pressureless Sintering