Abstract:With the dramatic requirements of high power and high integrity in field of power devices, the study of novel interconnection materials and packaging methods has been paid an extremely attention. Presently, the most candidates for the chip bonding are Zn-based, Bi-based, noble-metal-based (such as Au-Sn, Au-Ge, Au-Si), nano-metal particles (Ag or Cu nanoparticles) and transient-liquid-phase (TLP) bonding. However, a high bonding temperature and poor ductility for Zn-based solder (more than 420°C) causing irreversible damages or accelerated aging affects to the electronic devices; Bi-based solder alloys are still under way mainly due to their inferior thermal and electrical conductivity as well as poor workability; It's worth noting that nano-silver sintering and TLP bonding technology have been proven to be the potential solutions to the power electronic packaging, because their processing temperatures are relatively low and the produced joints are of high re-melting temperatures. However, Ag is expensive and easy to electromigration, which will influence the stability/reliability of the joints and hinder to universal industry applications. For the TLP bonding, the process to produce full intermetallic compounds (IMCs) is time-consuming, commonly more than 60 min, due to relatively low reaction velocity. To solve the problem of time-consuming of the TLP, an enhanced and low-cost auxiliary energy is necessary. Ultrasonic-assisted soldering has been proven able to solder dissimilar metals at low temperatures within a very short time. In our previous work, a full Cu6Sn5/Cu3Sn IMCs joint through TLP assisted by ultrasound was obtained. Because of the acoustic cavitation and streaming effect created by ultrasonic waves propagating in molten alloys, the atom diffusion and physical-chemical interactions were accelerated at the liquid/solid interfaces. However, a sole IMC joint with single phase has not been fabricated so far. High re-melting temperature joint consisted of nearly sole Ni 3 Sn 4 with a high shear strength of 43.4 MPa was achieved with Sn-24 wt.%Ni by ultrasonic-assisted soldering for 10 s. This rapidly formed intermetallic joint was phase-stable as isothermally aged at 300 °C for 72 h in air and its shear strength was 33.4 MPa due to the Ni 3 Sn 4 grains coarsening. These results demonstrate that the less time-consuming ultrasonic-assisted soldering has wide potentials for high-temperature power electronic packaging.

Fabrication of Cu@Sn Core-Shell Structured Particles and the Application in High Remelting Temperature Bonding

Fabrication of cu@sn core-shell structure preform and application in high temperature bonding

Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding

Die Attach Materials with High Remelting Temperatures Created by Bonding Cu@Sn Microparticles at Lower Temperatures

Die-attach Bonding at 230 °C Using Micron Sn-coated Zn Particles for High-Temperature Applications

Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

Low temperature bonding using microscale Cu particles coated with thin Sn layers at 200 °C

Transient Liquid-Phase Sintering Bonding Based on Cu40Sn60 (wt.%) Core/Shell Particles for High-Temperature Power Device Packaging

Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device

Fabrication of Sn-plated Cu foam for high-efficiency transient-liquid-phase bonding

Study of Electroless Sn-coated Cu Microparticles and Their Application As a High Temperature Thermal Interface Material

An Interconnection Method Based on Sn-coated Ni Core-Shell Powder Preforms for High-Temperature Applications

Cu@Sn@Ag Core–shell Particles Preform for Power Device Packaging under Harsh Environments

Rapid Formation of Intermetallic Joints with Sn/metal Composite Alloys by Ultrasonic-Assisted Soldering for High-Temperature Chip Attachment

Transient Liquid Phase Bonding of Cu@Sn Core–shell Particles with Added Sn–3.0Cu–0.5Ag

Ag-Sn Bimetallic Nanoparticles Paste for High Temperature Service in Power Devices

Fabrication of High-Temperature-resistant Bondline Based on Multilayer Core–shell Hybrid Microspheres for Power Devices

Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging

Sn-Coated Cu Microparticle Paste For High Power Device Packaging

Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application

Micron Sn-Cu Composite Solder for High-Temperature Applications Based on Transient Liquid Phase Bonding