Abstract:Carbon nanotubes (CNTs) are quasi-1D nanostructures that display both high thermal conductivity and intriguing low-dimensional phonon transport phenomena. In comparison to the advances made in the theoretical calculation of the lattice thermal conductivity of CNTs, thermal transport measurements of CNTs have been limited by either the poor temperature sensitivity of Raman thermometry technique or the presence of contact thermal resistance errors in sensitive two-probe resistance thermometry measurements. Here we report advances in a multi-probe measurement of the intrinsic thermal conductivity of individual multi-walled CNT samples that are transferred from the growth substrate onto the measurement device. The sample-thermometer thermal interface resistance is directly measured by this multi-probe method and used to model the temperature distribution along the contacted sample segment. The detailed temperature profile helps to eliminate the contact thermal resistance error in the obtained thermal conductivity of the suspended sample segment. A differential electro-thermal bridge measurement method is established to enhance the signal-to-noise ratio and reduce the measurement uncertainty by over 40%. The obtained thermal resistances of multiple suspended segments of the same MWCNT sample increase linearly with increasing length, revealing diffusive phonon transport as a result of phonon-defect scattering in these MWCNTs. The measured thermal conductivity increases with temperature and reaches up to 390+- 20 W m-1 K-1 at room temperature for a 9-walled MWCNT. Theoretical analysis of the measurement results suggests submicron phonon mean free paths due to extrinsic phonon scattering by extended defects such as grain boundaries. The obtained thermal conductivity is decreased by a factor of 3 upon electron beam damage and surface contamination of the CNT sample.

Establishing Ohmic contacts for in situ current-voltage characteristic measurements on a carbon nanotube inside the scanning electron microscope.

In-situ studies of electron field emission of single carbon nanotubes inside the TEM

Electrothermal Characterization of Single-Walled Carbon Nanotube (SWCNT) Interconnect Arrays

Electrothermal Characterization of Carbon Nanotube Field Effect Transistors (Cntfets)

Electrothermal investigation on through silicon multi-walled carbon nanotube via interconnects

Robust Ohmic contact junctions between metallic tips and multiwalled carbon nanotubes for scanned probe microscopy

Establishing Ohmic Contact of a Radial Compressed CNT Bundle with High Work Function Metal

Measuring Electronic Transport in a Single Carbon Nanotube Inside the SEM

In situ measurements on individual thin carbon nanotubes using nanomanipulators inside a scanning electron microscope

Characterization of the Resistance and Force of a Carbon Nanotube/Metal Side Contact by Nanomanipulation

Characterization of contact resistances in ceramic-coated vertically aligned carbon nanotube arrays

Electrical Transport Measurements of the Side-Contacts and Embedded-End-contacts of Platinum Leads on the Same Single-Walled Carbon Nanotube

Raman measurement of heat transfer in suspended individual carbon nanotube

Electrical Conductivity of Multiwall Carbon Nanotube Bundles Contacting with Metal Electrodes by Nano Manipulators inside SEM

Measurement of the intrinsic thermal conductivity of a multiwalled carbon nanotube and its contact thermal resistance with the substrate

Measuring the Electrical Characteristics of Individual Junctions in the SnO2 Capped ZnO Nanowire Arrays on Zn Substrate

Differential Multi-probe Thermal Transport Measurements of Multi-walled Carbon Nanotubes grown by Chemical Vapor Deposition

Fabrication and Electrical and Mechanical Properties of Carbon Nanotube Interconnections

Conductive contact area estimation for carbon nanotube via interconnects using secondary-electron imaging

Investigating Interfacial Contact Configuration and Behavior of Single-Walled Carbon Nanotube-Based Nanodevice with Atomistic Simulations

Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects