An Integrated Multichips Package Module With 30 kA Turn-Off Capability Based on Pulse Oscillation for Hybrid Circuit Breaker
Weibin Zhuang,Yifei Wu,Yi Wu,Mingzhe Rong,Xin Wu,Jianbao Zeng,Chuangchuang Tao
DOI: https://doi.org/10.1109/tie.2023.3294581
IF: 7.7
2023-01-01
IEEE Transactions on Industrial Electronics
Abstract:Most medium-voltage and high-voltage hybrid circuit breaker solutions usually adopt several expensive insulated gate bipolar transistors connected in parallel to achieve large current breaking, which is difficult to meet economic needs. Thus, this article presents an integrated multichips package module with a novel design. The press-pack housing design reduces 50% stray inductance compared with the discrete device scheme. It uses an oscillating circuit to achieve large current breaking. A 4-inch press-pack housing prototype consisting of the diode, thyristor, and gate-commutated thyristor chips is developed. The FEM analysis shows its internal inductance is below 30 nH, and its maximum temperature is around 86 °C under 2 kA condition. Next, the parameter design of the proposed module with 30 kA breaking capability is presented for demonstration. Moreover, experiments on the designed module are conducted to verify its feasibility. Finally, the cost analysis shows the proposed module has a lower cost, achieving a 58.3% cost reduction than the traditional commutation branch scheme.
automation & control systems,engineering, electrical & electronic,instruments & instrumentation