Abstract:The performance of plasma facing material (PFM) in nuclear fusion reactor is dramatically influenced by the synergy between steady heat loading and transient events. The negative and positive thermal stresses induced by a temperature gradient can trigger crack damage and even complete failure. Deep understanding the cracking mechanism is of great significance to optimize structure design and to improve service capability of PFM. Herein we combine the extended finite element method (XFEM) with the cohesive zone method (CZM) in order to unravel the characteristics of inter-granular micro-cracking formation in polycrystalline tungsten (W) by taking account of topological microstructure and external loading condition. From the macro component to the mesoscopic structure, the temperature and stress distributions of W/Cu/CuCrZr monoblock under steady state coupled with cyclic transient event is first numerically investigated and compared with the results from experimental measurement. Then, by using the displacement rate estimated from the heat-energy-variation-induced accumulated plastic strain on the surface of monoblock as a bridge, the inter-granular crack propagation behaviors in the equiaxial grain (EG), gradient grain (GG) and heterogeneous grain (HG) structures of the cross-sectional component and in different surface grain sizes of component are predicted, respectively. It is found that higher heat loading with longer duration time leads to the increment of cumulative plastic strain level so that crack extension rate is accelerated. The GG structure exhibits a remarkable improvement on crack development since the change of inter-granular crack path at the triple point is influenced by the inclined boundary with respect to the loading direction. These results provide valuable insights into the correlation of grain morphology and brittle crack growth, especially focusing on further improvement of PFM.

Thermal shock behavior of W/Cu functionally gradient material

HIGH HEAT LOAD PROPERTIES OF W/Cu FUNCTIONALLY GRADED MATERIALS

Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component

Thermal Shock Performance of CVD Tungsten Coating at Elevated Temperatures

Microstructural evolution of graded W-Cu materials under repeated thermal shocks

Influence of Surface Morphology and Microstructure on Performance of CVD Tungsten Coating under Fusion Transient Thermal Loads

Multi-factor coupled failure mechanism of W–Cu functionally graded material under thermal shock service

Fabrication and microstructure of W/Cu functionally graded material

Tungsten Joining with Copper Alloy and Its High Heat Load Performance

High Heat Flux Testing of B4C/Cu and SiC/Cu Functionally Graded Materials Simulated by Laser and Electron Beam

Effect of High Temperature Annealing on the Microstructure and Thermal Shock Resistance of Tungsten Coatings Grown by Chemical Vapor Deposition

Experimental and Numerical Simulations of ELM-like Transient Damage Behaviors to Different Grade Tungsten and Tungsten Alloys

Mechanical Properties and Thermal Shock Performance of W-Y2O3composite Prepared by High-Energy-rate Forging

Optimum design of W/Cu functionally graded material for thermal stress mitigation

Thermal shock behaviors of W/Cu joints with different structures

Fabrication of Diamond/w–cu Functionally Graded Material by Microwave Sintering

Fabrication of W–Cu Functionally Graded Material with Improved Mechanical Strength

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Thermal Stress Reduction in a W/Cu Functionally Graded Material Used As a Divertor Component

Fast fabrication of W-Cu functionally graded material by high-gravity combustion synthesis and melt-infiltration

Microstructure-based crack formation in tungsten exposed to cyclic transient heating