Abstract:The stability of W–Cu functionally graded material (FGM) as a heat sink connecting material is of significant importance for long-term service under high-temperature thermal cycling conditions. In this study, W–Cu FGM was successfully fabricated by powder metallurgy method. Various thermal shock experiments were performed on the samples at different temperatures and cycles, and a comprehensive investigation was conducted into its service failure mechanisms. The findings demonstrate that as the temperature increases to 1000 °C, the layer with low copper content gradually developed microcracks, and the microstructure changed from the original uniform distribution to a copper granular exudation, ultimately forming a network-like copper layer. The layer with high copper content undergoes a transition from slight undulations and roughness to the emergence of numerous cracks and pores, accompanied by the formation of a larger area of copper pool structures. After 1000 °C thermal shock for 200 cycles, the thermal conductivity decreases from 215.33 W m −1 K −1 to 168.24 W m −1 K −1 , the bending strength decreased from 686.75 MPa to 115.77 MPa at room temperature, with reductions of 22.4 % and 81.2 %, respectively. At this point, the sample severely failed. The study highlights that the thermal shock failure mechanism of the gradient W–Cu samples is a novel multifactor coupled failure mechanism. It is influenced by the combined effects of crack initiation and propagation induced by thermal stress and the evolution of microstructural changes.

HIGH HEAT LOAD PROPERTIES OF W/Cu FUNCTIONALLY GRADED MATERIALS

High Heat Flux Testing of B4C/Cu and SiC/Cu Functionally Graded Materials Simulated by Laser and Electron Beam

Tungsten Joining with Copper Alloy and Its High Heat Load Performance

Experimental and Numerical Simulations of ELM-like Transient Damage Behaviors to Different Grade Tungsten and Tungsten Alloys

Thermal shock behavior of W/Cu functionally gradient material

Thermal Shock Performance of CVD Tungsten Coating at Elevated Temperatures

Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component

Progress of High Heat Flux Component Manufacture and Heat Load Experiments in China

High Heat Flux Testing of Tungsten Plasma Facing Materials

Performance of W/Cu FGM Based Plasma Facing Components under High Heat Load Test

Simulation and Study of Manufacturing of W–Cu Functionally Graded Materials by a Selective Laser Melting Process

Behaviors of Full Compositional W/Cu Functionally Gradient Materials Exposed to the Edge Plasma of HT-7 Tokamak

Surface Cracking of Tungsten-Vanadium Alloys under Transient Heat Loads

Microstructural evolution of graded W-Cu materials under repeated thermal shocks

Fabrication of Thick W Coatings by Atmospheric Plasma Spraying and Their Transient High Heat Loading Performance

High Heat Loading Performance of Actively Cooled W/Cu FGM-based Components

Multi-factor coupled failure mechanism of W–Cu functionally graded material under thermal shock service

Simulation of Thermal Stress of W/Cu Functionally Graded Coatings for Plasma Facing Materials

Fabrication and Application of W/Cu Functionally Graded Material

Experimental and Numerical Studies on W–Cu Functionally Graded Materials Produced by Explosive Compaction–welding Sintering

Comparative study on W/Cu FGMs doping TiC and La2O3