Influences of solution Ph and current density on coercivity of electroplating CoNdNiMnP permanent magnetic alloy film arrays

Hongchuan Jiang,Wanli Zhang,Jinping Zhang,Wenxu Zhang,Bin Peng,ShiQing Yang
2004-01-01
Acta Metallurgica Sinica (English Letters)
Abstract:The influences of plating bath solution PH and current density on coercivity of electroplating CoNdNiMnP permanent magnetic film arrays were studied. The experiment results show that both for solution PH and current density there were the best depositing parameters. Too high and too low plating bath solution PH or current density both result in decreasing of the film array coercivity. When solution PH is 3.5 and current density is 5 mA/cm2, the prepared film array coercivity can reach the maximum.
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