Fermi-Level Pinning Induced Thermal Instability in the Effective Work Function of Tan in Tan/Sio2 Gate Stack

C Ren,HY Yu,JF Kang,YT Hou,ME Li,WD Wang,DSH Chan,DL Kwong
DOI: https://doi.org/10.1109/led.2004.824251
IF: 4.8157
2004-01-01
IEEE Electron Device Letters
Abstract:In this letter, we demonstrate for the first time that the Fermi-level pinning caused by the formation of Ta(N)-Si bonds at the TaN/SiO2 interface is responsible for the thermal instability of the effective work function of TaN in TaN/SiO2 devices after high temperature rapid thermal annealing (RTA). Because of weak charge transfer between Hf and Ta(N) and hence negligible pinning effect at the TaN/HfO2 interface, the effective work function of TaN is significantly more thermally stable on HfO2 than On SiO2 dielectric during RTA. This finding provides a guideline for the work function tuning and the integration of metal gate with high-kappa, dielectric for advanced CMOS devices.
What problem does this paper attempt to address?