Research and education in MEMS and optoelectronics packaging in China

Sheng Liu,Zhiyin Gan,Peigen Li,Lining Sun,Li Gong

DOI: https://doi.org/10.1109/ECTC.2004.1320348

2004-01-01

Abstract:A review of research and education in MEMS and optoelectronic packaging research in China is given in terms of the major institutions, equipment, research topics. The author also discusses major activities of China in MEMS and optoelectomic packaging.

What problem does this paper attempt to address?

The Status of Power Electronics Research and Application in China

Dehong Xu,Ke Ma,Min Chen

DOI: https://doi.org/10.1109/icit.2010.5472646

2010-01-01

Abstract:Technologies and markets of power electronics in China have significantly changed and developed last decades. This paper firstly reviewed progresses of power electronics technology in China. Then China's power electronics markets are investigated. Finally, China's future promising fields related to power electronics are presented.
The Conception of MEMS and Current Development at Home and Abroat

刘文耀,杜君文,应济

DOI: https://doi.org/10.3969/j.issn.1002-2333.2001.02.002

2001-01-01

Abstract:The principle and relevant technology of GEMS are introduced. The current development of this technology at home and abroad and the prospect are also involved.
Research on Microelectron-Mechanical System and Its Application

Shi-xiang Jiang,Shi-qiang ZHU,Wen-sheng Huang

2001-01-01

Abstract:Theoretical and technical basis of MEMS are introduced.Future application of microelectron-machine to space,medicine,national defense and industries are listed in this paper.
Study of MEMS packaging technology

Yufeng Zhang,XiaoYun Tan,Weiping Chen,Guowei Zhang,Xiaowei Liu

DOI: https://doi.org/10.1109/ICEPT.2005.1564712

2005-01-01

Abstract:This paper will describe the status and effects of packaging in the MEMS devices. It is pointed out that there are several marked characteristics in the MEMS differences with compare with that of IC packaging. Meanwhile it presents several methods and developing trends of MEMS packaging with the particular emphasis on analysis of its applications, including the packaging means and testing results after packaging of microaccelerometers, acoustic-vibration sensors and other MEMS devices. Some useful thoughts are also obtained. Finally the existing problems and the future directions of MEMS packaging technology are discussed. © 2005 IEEE.
The High Education of Optical Engineering in East China

Xu Liu,XiangDong Liu,XiaoPing Wang,Jian Bai,YuLing Liu

DOI: https://doi.org/10.1117/12.2070286

2014-01-01

Abstract:The history and the development of the high education in the field of optical engineering in the area of East China will be presented in the paper. The overall situation of research and human resource training in optics and photonics will also be reviewed, it shows that China needs lots of talents and experts in this field to support the world optical industry in East China
States on education of power electronics and electrical drive in China's University

Yang Geng,Huang Lipei,Xu Dehong,Zhou Honglin

DOI: https://doi.org/10.1109/IPEC.2010.5543202

2010-01-01

Abstract:This paper describes the educational states and recent changes of power electronics (PE) and electrical drive (ED) in China's universities. The factors which promote the progress of the PE and ED education recently are introduced, such as teaching programs and typical textbooks, R&D cooperation with companies and R&D institutes at the universities, and the government's educational projects and foundations. An example about the course reform on electrical machinery and drive in Tsinghua Univ. is explained. © 2010 IEEE.
Packaging Investigation of Optoelectronic Devices

Zhang Zhike,Liu Yu,Liu Jianguo,Zhu Ninghua

DOI: https://doi.org/10.1088/1674-4926/36/10/101001

2015-01-01

Journal of Semiconductors

Abstract:Compared with microelectronic packaging, optoelectronic packaging as a new packaging type has been developed rapidly and it will play an essential role in optical communication. In this paper, we try to summarize the development history, research status, technology issues and future prospects, and hope to provide a meaningful reference.
Development Of An Industry-Oriented Graduate Course On Microelectronic Packaging In China

Xiu-Lan Cheng,Yu-Zhuo Fu,Cheng Yang,Yan Chen

DOI: https://doi.org/10.1115/IPACK2007-33334

2007-01-01

Abstract:With the rapid growth of IC industry in China, microelectronic packaging industry is playing more and more important role in this country. And the lack of talents on microelectronic packaging becomes the bottleneck to limit the development of microelectronic packaging industry in China. So with the great support from Intel, an industry-orientated graduate course on microelectronic packaging was developed in Shanghai Jiao Tong University and opened to all graduates or senior undergraduates in this university. This course is designed to serve as an introduction and a review on microelectronic packaging. Some topics about design considerations, materials, process flow and typical techniques of microelectronic packaging including advanced packaging technologies are addressed. Fundamentals and methodologies of reliability and failure analysis are also covered in this course. At last, a brief introduction on PCB assembly is concerns. A laboratory experiment and factory visiting on packaging process are included in this course to improve the students' practice ability and deepen their comprehension on modem packaging manufacturing. Most of lectures in this course are taught by experienced engineers from industry to increase its characterization on industrialization. This course will be helpful to students intending to specialize in microelectronic packaging. At last further plans on this course and related curriculum about microelectronic packaging are introduced briefly.
Optoelectronic Device Research in China

BK ZHOU,QM WANG,LH CHEN

DOI: https://doi.org/10.1117/12.144120

1993-01-01

Abstract:Research activities on optoelectronic devices in China are reviewed with emphasis on quantum well semiconductor lasers, DFB laser diode and wideband tunable narrow-linewidth external cavity laser diode, laser diode pumped solid state and single crystal fiber lasers, doped fiber ring laser, semiconductor and doped fiber amplifiers, optical modulators, switches and bistable devices.
Semiconductor Devices Packaging Industry and Equipments for Semiconductor Devices Packaging

Jia Song-liang

DOI: https://doi.org/10.3969/j.issn.1004-4507.2003.01.005

2003-01-01

Abstract:This paper briefly introduces the development of international and domestic semiconductor devices packaging industry, and presents that China will become one of the important base of international semiconductor devices packaging. This will provide good prospects in market for development of semiconductor devices packaging equipments in China. This paper also introduces the main packaging equipments.
Advanced packaging technology for MEMS

王海宁,王水弟,蔡坚,贾松良

DOI: https://doi.org/10.3969/j.issn.1003-353X.2003.06.004

2003-01-01

Abstract:Some particularities for MEMS packaging:special signal interfaces, 3D-structureconfigurations, requirements of cases, passivation and reliability are summarized in this paper.Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. The research and development of MEMSpackaging should be strengthened.
Recent achievements in research for electronic packaging substrate materials

张强,孙东立,武高辉

DOI: https://doi.org/10.3969/j.issn.1005-0299.2000.04.016

2000-01-01

Abstract:Reviews the elemental requirements for electronic packaging substrate materials, and analyses the characteristics of ceramics, epoxy glasses, diamond, metals and metal matrix composites used for electronic packaging, and discusses the recent achievements in the research for electronic packaging substrate materials.
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li,Xing-Chang Wei,Andreas C. Cangellaris,En-Xiao Liu,Yao-Jiang Zhang,Marcello D'Amore,Joungho Kim,Toshio Sudo

DOI: https://doi.org/10.1109/temc.2010.2048755

IF: 2.036

2010-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of effi...
Nanomaterial in Microwave and Millimeterwave Engineering Research in China

Erping Li,Yili Xu,Wei Hong

DOI: https://doi.org/10.1109/eumc.2014.6986598

2014-01-01

Abstract:Recently, nanomaterial is a topic of very attractive research fields from science to potential applications in microwave components and circuits. This paper briefly overviews the graphene and some other nanomaterials research and development (R&D) of institutions in China. For microwave applications, we show interconnect, transistors and some other applications.
Recent Development of Micro Electronic Packaging Materials

Chen Junjun,Fu Yuepeng,Tian Minbo

DOI: https://doi.org/10.3969/j.issn.1003-353X.2008.03.001

2008-01-01

Abstract:The recent situation of researching and making of key packaging materials are summarized,including BUM,FPC,lead-free solder,ACA etc.The problems of development and trend in future are given.BUM and FPC will be main substitute materials in the 21st century to fit three-dimensional packaging and the technology will be simpler and cheaper.Lead-free solder accords with environmentalism,but its cost remains high.Electric glue will be a new connection material to replace solder at low temperature.
Green Chemical Engineering in China

Xiangping Zhang,Changjun Liu,Qilong Ren,Xueqing Qiu,Baohua Xu,Xintong Zhou,Yuanbang Xie,Hongming Lou,Mohammad Chand Ali,Hongshuai Gao,Yinge Bai,Suojiang Zhang

DOI: https://doi.org/10.1515/revce-2017-0038

2019-01-01

Reviews in Chemical Engineering

Abstract:In China, the rapid development greatly greatly promotes the national economic power and living standard but also inevitably brings a series of environmental problems. In order to resolve these problems fundamentally, Chinese scientists have been undertaking research in the area of green chemical engineering (GCE) for many years and achieved great progresses. In this paper, we reviewed the research progresses related to GCE in China and screened four typical topics related to the Chinese and screened four typical topics related to the Chinese resources characteristics and environmental requirements, i.e. ionic liquids and their applications, biomass utilization and bio-based materials/products, green solvent-mediated extraction technologies, and cold plas-mas for coal conversion. Afterwards, the perspectives and development tendencies of GCE were proposed, and the challenges which will be faced while developing available industrial technologies in China were mentioned.
Performance Enhancement Research for Printed Circuit Board Manufacture in China

J. Mao,J. Li,M. Tang,Linyan Wu

DOI: https://doi.org/10.1109/mwsym.2011.5973123

2011-01-01

Abstract:Summary form only given, as follows. In this paper, a concise survey about the development of China's printed-circuit board (PCB) industry is given first, followed by technical problems that China has to overcome to continue her leadership in PCB industry. Then, some typical basic research results achieved in recent years in China towards solving the technical challenges are introduced. At last, some discussion about the future research program and activities in China is presented.
Ecomaterials Research States in China

ZH Jin,GJ Qiao,TM Wang,TY Zuo

DOI: https://doi.org/10.1109/ecodim.1999.747613

1999-01-01

Abstract:Ecomaterials research states in China were reviewed in this paper. It involves the improvements in the following five fields: (1) Basic research on ecomaterials (2) Life-cycle assessment of materials and products (3) Ecodesign--materials and products (4) Recycling and reuse of industrial solid wastes (5) Materials for ameliorating environment
Advances in Packaging Design and Research on High-power White LED

CHEN Ming-xiang,LUO Xiao-bing,MA Ze-tao,LIU Sheng

DOI: https://doi.org/10.3969/j.issn.1001-5868.2006.06.001

2006-01-01

Abstract:Innovative designs,materials and structures of packaging have led to dramatic improvements of the performances in LED technology.The rapid progresses in packaging design and research of high-power white light emitting diodes(LEDs) have been overviewed.The packaging design of LED has been summarized in the view of optics,thermology,electrics,mechanics and reliability,and the packaging material and processes have been introduced in detail.It is proposed that packaging and chip of LED should be co-designed,and the effect of optical,thermal,electrical and mechanical should be considered at the same time.Although it is important to choose packaging materials(such as thermal spreading substrate,phosphors and silicone),the interface thermal resistance and thermal stress resulting from packaging processes have greater effect on the luminous efficiency and reliability of packaged LED.
MEMS Technology Status and Development Prospects

G. Yu.

Abstract:The development status,processing technologies and product markets of Micro Electro Mechanical Systems(MEMS) technology are introduced.The packaging technology and existing problems of MEMS product are mainly discussed,combining the MEMS materials and processing techniques,and the development prospects of MEMS technology are prospected.

Engineering,Materials Science

Research and education in MEMS and optoelectronics packaging in China

The Status of Power Electronics Research and Application in China

The Conception of MEMS and Current Development at Home and Abroat

Research on Microelectron-Mechanical System and Its Application

Study of MEMS packaging technology

The High Education of Optical Engineering in East China

States on education of power electronics and electrical drive in China's University

Packaging Investigation of Optoelectronic Devices

Development Of An Industry-Oriented Graduate Course On Microelectronic Packaging In China

Optoelectronic Device Research in China

Semiconductor Devices Packaging Industry and Equipments for Semiconductor Devices Packaging

Advanced packaging technology for MEMS

Recent achievements in research for electronic packaging substrate materials

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Nanomaterial in Microwave and Millimeterwave Engineering Research in China

Recent Development of Micro Electronic Packaging Materials

Green Chemical Engineering in China

Performance Enhancement Research for Printed Circuit Board Manufacture in China

Ecomaterials Research States in China

Advances in Packaging Design and Research on High-power White LED

MEMS Technology Status and Development Prospects