Study of the residual stress distribution in SiCp/Al composites under thermal cycling conditions
Junge Yao,Qingping Wang,Chao Zhang
DOI: https://doi.org/10.1177/00219983241302165
IF: 3.191
2024-11-17
Journal of Composite Materials
Abstract:Journal of Composite Materials, Ahead of Print. In this study, a three-dimensional random representative volume element model was constructed using the finite element method combined with Python script to investigate the residual stress distribution in SiCp/Al composites with varying volume fractions, particle shapes, and particle size under thermal cycling conditions. The model has two different particle morphologies: spheres and irregular polygons. The results show that the irregular polygonal SiC particles exhibit higher residual stresses than spherical particles before and after thermal cycling due to their complex load transfer pathways and higher stress concentration at particle corners, which makes them more consistent with the characterization of SiCp/Al composites under practical application conditions. As the volume fraction of SiC particles increases, the particle spacing decreases, hindering the release of thermal stresses through plastic deformation. Notably, the relief rate of residual stress reached 53% in the 12 vol% SiCp/Al composites, with the stress decreasing from 698 MPa to 328 MPa after 50 thermal cycles. In contrast, the reduction rate for 18 vol% composites is only 13% after thermal cycling. Furthermore, compared to larger particles (7.3 μm, 8.9 μm), the smaller particles (4.3 μm, 5.9 μm) exhibit a more uniform stress distribution and lower thermal stresses before and after thermal cycling. Consequently, our work provides a significant theoretical basis for the design and application of SiCp/Al composites, especially for the application of materials under extreme temperature changes.
materials science, composites