Metallization of CVD diamond surface with Cr/Cu/Ni/Au thin film

Xiaodong Zhu,Jifeng Chen,Rujuan Zhan,Donsheng Yao,Xiaohui Wen,Hua Wang
1997-01-01
Abstract:The metallization of diamond surface with Cr/Cu/Ni/Au multilayer thin film was performed by chemical vapor deposition (CVD). The adhesion strength of the film with respect to the diamond substrate is high. By analyzing the interface between the film and substrate, it was found that there is no chemical reaction between Cr and CVD diamond when the metallization temperature is below 300��C. It was also found that Cr3C2 and Cr7C3 are formed in the interface after heat treatment at about 900��C.
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