Preliminary investigation of a second thermoplastic modifier incorporation effect on the phase behavior and morphology of epoxy/PEI curing systems
Qiang Zheng,Kuitian Tan,Zhonghua Lin,Yi Pan
DOI: https://doi.org/10.1023/A:1015477525643
2002-01-01
Journal of Materials Science Letters
Abstract:High performance engineering thermoplastics modified epoxy resins are novel materials avoiding the usual shortcomings of rubber modification (i.e., reduction of glass transition temperature, yield strength, and elastic modulus), and having improved impact strength and fracture toughness [1, 2]. Although the use of thermoplastic modifier has been important for the improvement of fracture toughness is a mechanical property high performance epoxy resins, there is limited information concerning the interfacial control between thermoplastic modifier and epoxy resins [3]. And in most cases, commercial thermoplastics are directly used as modifiers without effective control of the interface between the dispersed phase and the cured epoxy resin. There are two ways to improve the interfacial adhesion between the dispersed thermoplastics phase and the cured epoxy resin. The first is to chemically modify or functionalize the thermoplastics modifier. The second is to introduce mutual interaction, such as dipole-dipole interaction, hydrogen-bonding etc., into the curing system to improve the compatibility. Recent studies have shown that the interfacial adhesion between thermosets and thermoplastics can be dramatically improved when interdiffusion is possible [4]. Here, we prefer the second way since the development of functional polymers is still limited to the laboratory and it is a high cost process. This paper reports the incorporation effect of a second thermoplastics modifier (PC), on the phase separation behavior and morphology of PEI modified E-51 curing systems by using small angle laser light scattering (SALLS) and scanning electron microscopy (SEM, Hitachi S-570). The samples were made by incorporating various contents of polyetherimide (PEI; General Electric Co., USA) and polycarbonate (PC, based on bisphenonl-A; Idenitsu Kosan Co., Japan) into E-51 (a commercial grade epoxy resin based on diglycidyl ether of bisphenonl-A; Hangzhou Chemical Plant China) by weight. Then cured with 4,4 � diamino-diphenylsulphone (DDS; Chemical agent Co., China).