Improved Properties of HfO2/Al2O3/GaSb MOS Capacitors Passivated with Neutralized (NH4)2S Solutions

Zhen Tan,Lianfeng Zhao,Jing Wang,Jun Xu
DOI: https://doi.org/10.1149/2.003308ssl
2013-01-01
ECS Solid State Letters
Abstract:The effects of the Al2O3 interfacial layer (IL) insertion and the neutralized (NH4)(2)S solution passivation on HfO2/GaSb MOS devices were investigated. The interface trap density (Dit) was reduced by similar to 20% for samples with an Al2O3 IL. Sulfur passivation with the neutralized (NH4)(2)S solution could effectively prevent the oxidization of the substrates, as such reducing the equivalent oxide thickness by 30%. Consequently, a combination of the neutralized (NH4)(2)S solution passivation and an Al2O3 IL insertion is found to be a promising technique to improve the performance of Hf-based high-k/GaSb MOS devices. (c) 2013 The Electrochemical Society. All rights reserved.
What problem does this paper attempt to address?