Precise Injection Molding Combined with Ultrasonic Bonding for Chip Fabrication of Centrifugal Microfluidic Immunoassay System
Yuxing Shi,Peng Ye,Chuang Wang,Jinhong Guo,Bayin Qiaoge,Jiawen Xie
DOI: https://doi.org/10.1109/icmimt55556.2022.9845312
2022-01-01
Abstract:Microfluidic chip is the core module of centrifugal microfluidic immunoassay system. Its precision and bonding strength affect the performance of the system to a great extent. However, on the one hand, traditional ways of improving the precision of chip's microstructure needs auxiliary equipment (such as infrared and ultrasonic), on the other hand, traditional bonding technologies have problems of complex operation, low bonding strength and poor stability, which are not conducive to the mass production of microfluidic chips with high precision and high bonding strength. In view of this, this paper proposed an improved precise injection molding technology combined with ultrasonic bonding technology. Firstly, the solvent assisted precise injection molding technology was proposed to obtain chips with microstructures of high precision and without mold sticking (the transmission accuracy is 98%). Then, precise injection molding was combined with ultrasonic bonding technology to realize complete fabrication of chips, the variation in depth of microchannels as low as 0.3% and the burst pressure as high as 632 kPa were obtained. Finally, no obvious liquid leakage was observed through the liquid flow test. The experimental results above show that the improved precise injection molding combined with ultrasonic bonding technology can easily and quickly realize high bonding strength on the basis of maintaining the detailed characteristics of microchannels. This technology not only provides a reliable method for the fabrication of high-precision PMMA chips, but also meets the goal of rapid and sensitive centrifugal microfluidic immunoassay, which is a novel fabrication technology for microfluidic chip.