Multifractal analysis for Cu/Ti bilayer thin films

Qijing Lin,Shuming Yang,ChenYing Wang,JianJun Ding,Zhuangde Jiang

DOI: https://doi.org/10.1002/sia.5258

2013-01-01

Surface and Interface Analysis

Abstract:Two bilayer thin films with different stacking sequences, Cu/Ti/Si and Ti/Cu/Si, were deposited by DC magnetron sputtering technique. X-ray diffraction technique was used to measure the crystallization structures, and scanning electron microscopy and atomic force microscopy were used to measured surface morphology. The multifractal spectra f()- was used to characterize the surface morphology. The result of |q|(max)53 is obtained by multifractal analysis. The shape of the multifractal spectra f()- is hook-like for Cu/Ti/Si and bell jar-like for Ti/Cu/Si. The spectrum width =(max)-(min) and f(=f((min))-f((max))) of the multifractal spectra is able to quantitatively analyze the growth and surface roughness of the Cu/Ti bilayer thin films. The surface of Ti/Cu/Si thin film is more uniform and smoother than the film of Cu/Ti/Si. Copyright (c) 2013 John Wiley & Sons, Ltd.