Abstract:Sputtered Cu/Si thin films were experimentally prepared at different sputtering pressures and characterized using X-ray diffraction (XRD) and an atomic force microscope (AFM). Simultaneously, an application-oriented simulation approach for magnetron sputtering deposition was proposed in this work. In this integrated multiscale simulation, the sputtered atom transport was modeled using the Monte Carlo (MC) and molecular dynamics (MD) coupling method, and the deposition of sputtered atoms was simulated using the MD method. This application-oriented simulation approach was used to simulate the growth of Cu/Si(100) thin films at different sputtering pressures. The experimental results unveiled that, as the sputtering pressure decreased from 2 to 0.15 Pa, the surface roughness of Cu thin films gradually decreased; (111)-oriented grains were dominant in Cu thin films and the crystal quality of the Cu thin film was gradually improved. The simulation results were consistent with the experimental characterization results. The simulation results revealed that the transformation of the film growth mode from the Volmer-Weber growth mode to the two-dimensional layered growth mode resulted in a decrease in the surface roughness of Cu thin films; the increase in the amorphous compound CuSix and the hcp copper silicide with the decrease in the sputtering pressure was responsible for the improvement of the crystal quality of the Cu thin film. This work proposed a more realistic, integrated simulation scheme for magnetron sputtering deposition, providing theoretical guidance for the efficient preparation of high-quality sputtered films.

Characterization of Multiscale Surface Evolution of Polycrystalline Copper Thin Films

Homologous Temperature Dependence of Global Surface Scaling Behaviors of Polycrystalline Copper Films

Fractal Description of Surface Topography of Ultrathin Au Films

Surface roughening and texture of the poly-crystalline columnar copper films

Scaling Behaviors of Surface Roughening of Cu Thin Films Deposited by Oblique Angle Deposition

Study on Multifractal Spectrum of Semicontinuous Ag Films

Surface Roughening and Growth Mode Transition of Polycrystalline Thin Films

Characterization of Surface Morphology of Copper Tungsten Thin Film by Surface Fractal Geometry and Resistivity

Surface Characterization of Cu/Ti Thin Films by Fractal Analysis

Multifractal analysis for Cu/Ti bilayer thin films

Effect of Substrate on Surface Morphology Evolution of Cu Thin Films Deposited by Magnetron Sputtering

Universal fluctuations in the growth of semiconductor thin films

Kinetic Roughening with Surface Diffusion: Crossover from Ramified Aggregates to Continuous Films on Liquid Surfaces

Surface Dynamic Evolution of Ta Film Growth in the Initial Stage

Stages of Structural Transformation in Iron Thin Film Growth on Copper (100)

On the Microcrystal Structure of Sputtered Cu Films Deposited on Si(100) Surfaces: Experiment and Integrated Multiscale Simulation

Surface Roughness Analysis of Cu Films Deposited on Si Substrates: A Molecular Dynamic Analysis

Multiscale Micromorphic Model For The Plastic Response Of Cu Thin Film

Cu-W Thin Film Characterized by Surface Fractal and Resistivity

Atomic assembly of Cu/Ta multilayers: Surface roughness, grain structure, misfit dislocations, and amorphization

ANISOTROPY BEHAVIOR OF SURFACE MORPHOLOGY AND PHASE STRUCTURE OF Cu-W THIN FILMS