Fabrication and Thermal Stability Characterisation of Ru Electrode Used for High Power Contact Radio Frequency Microelectromechanical System Switch

Hongze Zhang,Wei Wang,Zhihong Li
DOI: https://doi.org/10.1049/mnl.2013.0300
2013-01-01
Micro & Nano Letters
Abstract:Reported are the fabrication and thermal stability of an Ru electrode, which is used for a high power Ru-Au contact radio frequency microelectromechanical system switch with a microspring contact design. In this reported work, a new process with bilayer lift-off and a strain release layer is developed, thereby acquiring the 3000 angstrom Ti/Au/Ru electrode with excellent smooth edges for high-power handling capacity and low loss. Furthermore, thermal tests under 400, 500 and 600 degrees C for over 1 h have been performed. Investigation of the surface with scanning electron microscopy and energy dispersive X-ray spectroscopy shows that the electrode has a good thermal stability at 400 degrees C, which is proper for high-power handling. The cold switch DC current handling capacity is advanced from <90 mA per point (failed) to 100 mA per point (still working).
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